USPatentGranted

Apparatus and methods for handling a substrate

Granted 8 May 2001 · no office action yet

Application
206087
filed 4 Dec 1998
Publication
Not published
not published
Patent· this page
US 6,227,585
granted 8 May 2001

Life of the patent

3 dated events
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Abstract

Substrate handling apparatus and methods are described. In one aspect, the substrate handling apparatus includes a clamping member having an extended condition wherein substrate movement relative to the transfer arm is substantially restricted and a retracted condition wherein substrate movement relative to the transfer arm is substantially free. The substrate handling apparatus further includes a sense mechanism (e.g., a vacuum sensor) constructed to determine whether a substrate is properly positioned on the support arm and to trigger the mode of operation of the clamping member between extended and retracted conditions. The sense mechanism also provides information relating to the operating condition of the clamping member.

Claims

36 · 11 independent · depth 3
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36 granted claims

Classifications

4 codes
USPC · US Patent Classification
294/64.1414/941294/103.1294/907

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Pendency
2.4 y
886 days filing → grant
Office actions
0
on the grant's record
Examiner
Dean J. Kramer
art unit —
Citations: 16 back · 0 forward

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