Inventor
Chien-Hung Liu
Inventor
Taipei, TW
Overview
Patents· 172 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
H01LSemiconductor devices13%
H10DInorganic electric semiconductor devices12%
H10BElectronic memory devices9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H05KPrinted circuits6%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation6%
G06FElectric digital data processing3%
H01HElectric switches2%
B41JTypewriters1%
PatentTitleYear
11,037,949Embedded memory using SOI structures and methods202110,879,258Memory cell comprising a metal control gate with a work function for an enlarged operation window202010,878,915Memory device and method for programming the same202010,879,256Embedded memory using SOI structures and methods202010,854,618Memory device and method of forming the same202010,840,333Semiconductor arrangement and method of manufacture202010,823,849Tracking-distance-measuring system for torso tracking and method thereof202010,775,242Tracking and ranging system and method thereof202010,755,873Membrane circuit board and keyboard device with same202010,755,878Keyboard device202010,694,292Environmental detection system and sound control method using the same202010,672,783Integrated circuit and method for manufacturing the same202010,651,211Thin film transistor and preparation method thereof, array substrate and display apparatus202010,510,767Integrated circuit and method for manufacturing the same201910,446,410Method of processing surface of polysilicon and method of processing surface of substrate assembly201910,401,970Keyboard device and manufacturing method thereof201910,367,073Thin film transistor (TFT) with structured gate insulator201910,157,875Chip package and method for forming the same201810,157,811Chip package and method for forming the same201810,096,663Manufacturing method of array substrate, array substrate and display device201810,069,298Inverter and control method thereof201810,056,419Chip package having chip connected to sensing device with redistribution layer in insulator layer201810,020,135Key structure and scissors-type connecting member thereof20189,997,547Carrier substrate having a plurality of fluid passages and method of fabricating display apparatus utilizing the same20189,966,358Chip package20189,959,994Keyboard20189,941,071Key structure20189,941,068Key structure20189,935,148Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer20189,887,213'Method for manufacturing thin film transistor and related active layer for thin film transistor, thin film transistor, array substrate, and display apparatus'20189,831,185Chip package and fabrication method thereof20179,818,775'Array substrate, manufacturing method thereof, display device, thin-film transistor (TFT) and manufacturing method thereof'20179,812,413'Chip module and method for forming the same'20179,780,050'Method of fabricating chip package with laser'20179,773,554'Composite impurity scheme for memory technologies'20179,771,259'Method for fabricating electronic device package'20179,768,067'Chip package and manufacturing method thereof'20179,761,510'Chip package and method for forming the same'20179,721,911'Chip package and manufacturing method thereof'20179,715,977'Keyboard with height-adjustable keys'20179,704,772'Chip package and method for forming the same'20179,640,405'Chip package having a laser stop structure'20179,634,043'Array substrate, manufacturing method thereof, display device, thin-film transistor (TFT) and manufacturing method thereof'20179,589,991'Thin-film transistor, manufacturing method thereof, display substrate and display device'20179,570,633'Semiconductor package and manufacturing method thereof'20179,543,415'Thin film transistor driving backplane and manufacturing method thereof, and display panel'20179,543,233'Chip package having a dual through hole redistribution layer structure'20179,455,007'Word line driver circuitry and compact memory using same'20169,424,979'Magnetic element with multiple air gaps'20169,422,042'Cantilevered rotatable carcass carrier'20169,406,578'Chip package having extended depression for electrical connection and method of manufacturing the same'20169,397,138'Manufacturing method of semiconductor structure'20169,376,181'Water craft able to offer fast rescue'20169,379,072'Chip package and method for forming the same'20169,337,115'Chip package and method for forming the same'20169,312,139'Semiconductor element having conductive damascene structures extending perpendicular to doping strips, and manufacturing method of the same'20169,281,243'Chip scale package structure and manufacturing method thereof'20169,225,200'Electronic device with connection interface supporting signal communication and charging operation'20159,216,898'Chip package and method for forming the same'20159,190,362'Image sensor package with trench insulator and fabrication method thereof'20159,181,084'Electronic device package and fabrication method thereof'20159,177,919'Chip package and method for forming the same'20159,158,609'Universal serial bus testing device'20159,088,206'Power module and the method of packaging the same'20159,077,199'Electronic device with connection interface supporting signal communication and charging operation'20159,035,456'Chip package and method for forming the same'20158,981,497'Chip package structure and method for forming the same'20158,975,106'Chip package and method for forming the same'20158,922,026'Chip package and fabrication method thereof'20148,872,196'Chip package'20148,867,832'Method for detecting and removing scrolling texts during video communication'20148,823,179'Electronic device package and method for fabricating the same'20148,809,933'Bit line structure, semiconductor device and method of forming the same'20148,789,754'Electronic device and protection mechanism thereof'20148,791,768'Capacitive coupler packaging structure'20148,778,798'Electronic device package and fabrication method thereof'20148,772,919'Image sensor package with trench insulator and fabrication method thereof'20148,748,949'Chip package with heavily doped region and fabrication method thereof'20148,723,485'Power supply system'20148,724,062'Common repair structures for close bus in a liquid crystal display'20148,722,463'Chip package and fabrication method thereof'20148,710,680'Electronic device package and fabrication method thereof'20148,713,227'Accessing device via communication protocol selection'20148,692,284'Interposer and manufacturing method thereof'20148,643,070'Chip package and method for forming the same'20148,624,351'Package structure and method for making the same'20148,614,488'Chip package and method for forming the same'20138,610,200'Nitride read only memory device with buried diffusion spacers and method for making the same'20138,575,791'Manufacturing-process equipment'20138,508,606'System and method for deblurring motion blurred images'20138,502,380'Chip package and fabrication method thereof'20138,497,534'Chip package with heavily doped regions and fabrication method thereof'20138,476,738'Electronic package with stacked semiconductor chips'20138,466,376'Enclosure of electronic device'20138,389,873'Enclosure of electronic device'20138,362,515'Chip package and method for forming the same'20138,357,987'Chip package and fabrication method thereof'20138,350,150'Enclosure of electronic device'20138,309,398'Electronic device wafer level scale packages and fabrication methods thereof'20128,305,774'Enclosure of electronic device'20128,305,156'Printed circuit board'20128,275,923'High speed data storage system'20128,270,180'Printed circuit board'20128,263,877'Printed circuit board'20128,264,631'Common repair structures for close bus in a liquid crystal display'20128,253,038'Enclosure of electronic device'20128,253,509'Printed circuit board'20128,203,082'Printed circuit board'20128,116,902'Method of detecting a dynamic path of a five-axis machine tool and dectecting assembly for the same'20128,111,405'Automatic scan and mark apparatus'20128,076,744'Photosensitizing chip package and manufacturing method thereof'20118,071,889'Electronic device with EMI screen and packing process thereof'20118,067,700'Via structure of printed circuit board'20118,068,553'System and method for evaluating performance of a MIMO antenna system'20118,058,557'Printed circuit board'20118,049,673'Electronic device and multi-frequency antenna thereof'20118,031,029'Differential signal transmission cable and method for compensating length offset thereof'20118,022,309'Flexible printed circuit board'20118,008,156'Nitride read only memory device with buried diffusion spacers and method for making the same'20117,981,727'Electronic device wafer level scale packages and fabrication methods thereof'20117,968,802'Printed circuit board with differential traces'20117,955,934'Nitride read only memory device with buried diffusion spacers and method for making the same'20117,925,999'Method of modifying vias connection of printed circuit boards'20117,852,478'Detecting assembly for a multi-axis machine tool'20107,804,122'Non-volatile memory'20107,781,680'Flexible printed circuit board'20107,773,234'Means for measuring a working machine\'s structural deviation from five reference axes'20107,753,675'Auxiliary position apparatus for injection molding machine'20107,652,324'NAND type dual bit nitride read only memory and method for fabricating the same'20107,635,814'Printed circuit board'20097,636,170'Static/dynamic multi-function measuring device for linear unit'20097,612,631'Motherboard'20097,608,504'Memory and manufacturing method thereof'20097,576,425'Conducting layer in chip package module'20097,572,691'Non-volatile memory and method of fabricating the same'20097,542,303'Printed circuit board'20097,527,360'Structure of inkjet-head chip'20097,358,184'Method of forming a conductive via plug'20087,307,018'Method of fabricating conductive lines'20077,299,016'Communication device with an adjustable brightness'20077,179,710'Method for fabricating NAND type dual bit nitride read only memory'20077,134,187'Method for making an inkjet-head chip structure'20067,108,961'Component for inkjet print head and manufacturing method thereof'20066,927,448'NAND type dual bit nitride read only memory'20056,876,044'UV-programmable P-type mask ROM'20056,841,830'Metal oxide semiconductor field effect transistors (MOSFETS) used in ink-jet head chips and method for making the same'20056,818,956'Non-volatile memory device and fabrication method thereof'20046,812,507'Non-volatile memory capable of preventing antenna effect and fabrication thereof'20046,794,701'Non-volatile memory'20046,787,416'Non volatile embedded memory with poly protection layer'20046,723,603'Method of utilizing fabrication process of poly-Si spacer to build flash memory with 2bit/cell'20046,713,315'Mask read-only memory and fabrication thereof'2004D0487457'Tablet personal computer'20046,680,227'Non-volatile memory device and fabrication method thereof'20046,666,545'Driver transistor structure of inkjet print head chip and the method for making the same'20036,664,164'UV-programmed P-type Mask ROM and fabrication thereof'20036,642,113'Non-volatile memory capable of preventing antenna effect and fabrication thereof'20036,627,500'Method of fabricating nitride read only memory'20036,620,694'Method of making non volatile memory with a protective metal line'20036,613,632'Fabrication method for a silicon nitride read-only memory'20036,580,630'Initialization method of P-type silicon nitride read only memory'20036,559,010'Method for forming embedded non-volatile memory'20036,551,880'Method of utilizing fabrication process of floating gate spacer to build twin-bit monos/sonos memory'20036,511,882'Method for preventing the leakage path in embedded non-volatile memory'20036,469,342'Silicon nitride read only memory that prevents antenna effect'20026,448,137'Method of forming an NROM embedded with mixed-signal circuits'20026,448,126'Method of forming an embedded memory'20026,444,519'Method for forming a capacitor in a mixed mode circuit device by ion implantation'20026,440,798'Method of forming a mixed-signal circuit embedded NROM memory and MROM memory'20026,436,800'Method for fabricating a non-volatile memory with a shallow junction'20026,432,778'Method of forming a system on chip (SOC) with nitride read only memory (NROM)'20026,413,815'Method of forming a MIM capacitor'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2017Patents assigned to MACRONIX INT CO LTD (38)· patent assignee history
2002–2020Based in Taipei, TW· patent location history
2005–2014Based in Hsinchu, TW· patent location history
2005–2021Based in Hsinchu County, TW· patent location history
2009–2018Patents assigned to XINTEC INC (30)· patent assignee history
2009–2013Patents assigned to HON HAI PREC IND CO LTD (24)· patent assignee history
2011–2015Patents assigned to LIU CHIEN-HUNG (50)· patent assignee history
2011–2013Patents assigned to PAI YU-CHANG (13)· patent assignee history
2013–2018Based in New Taipei, TW· patent location history
2017–2020Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LIU CHIEN-HUNGself | 50 | 2011–2015 |
| MACRONIX INT CO LTD | 38 | 2002–2017 |
| XINTEC INC | 30 | 2009–2018 |
| HON HAI PREC IND CO LTD | 24 | 2009–2013 |
| PAI YU-CHANG | 13 | 2011–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 72 | 2002–2020 |
| New Taipei, TW | 38 | 2013–2018 |
| Hsinchu, TW | 15 | 2005–2014 |
| Beijing, CN | 10 | 2017–2020 |
| Hsinchu County, TW | 9 | 2005–2021 |