Inventor
Nobuhide Yamada
Inventor
Tokyo, JP
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
C23CCoating metallic material10%
B05BSpraying apparatus8%
B05CApparatus for applying fluent materials to surfaces, in general8%
H10BElectronic memory devices8%
H01LSemiconductor devices6%
H10DInorganic electric semiconductor devices6%
C09DCoating compositions, e.g. paints, varnishes or lacquers4%
B05DProcesses for applying fluent materials to surfaces, in general2%
PatentTitleYear
11,098,405Film forming apparatus and film forming method20219,953,829Image processing apparatus with improved slide printout based on layout data20189,780,116'Semiconductor device and method for manufacturing the same'20179,190,262'Method of manufacturing semiconductor device and apparatus for manufacturing semiconductor device'20158,557,705'Method of manufacturing semiconductor device and apparatus for manufacturing semiconductor device'20138,071,157'Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus'20118,008,190'Method of manufacturing semiconductor device'20117,999,356'Composition for film formation, insulating film, semiconductor device, and process for producing the semiconductor device'20117,902,036'Method of fabricating semiconductor device and the semiconductor device'20117,799,368'Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus'20107,785,984'Manufacturing method for semiconductor device'20107,604,832'Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus'20097,312,018'Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus'20076,800,569'Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus'20046,737,363'Method of manufacturing semiconductor device'20046,645,881'Method of forming coating film, method of manufacturing semiconductor device and coating solution'20036,558,747'Method of forming insulating film and process for producing semiconductor device'20036,458,713'Method for manufacturing semiconductor device'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2015Patents assigned to TOSHIBA KK (14)· patent assignee history
2002–2011Based in Tokyo, JP· patent location history
2003Patents assigned to JSR CORP (2)· patent assignee history
2011–2013Patents assigned to YAMADA NOBUHIDE (2)· patent assignee history
2011Patents assigned to EMA TATSUHIKO (1)· patent assignee history
2011Based in Yokkaichi, JP· patent location history
2013–2015Based in Mie, JP· patent location history
2017–2021Patents assigned to TOSHIBA MEMORY CORP (3)· patent assignee history
2017–2018Based in Nagoya, JP· patent location history
2021Based in Yokohama-shi, Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 14 | 2002–2015 |
| TOSHIBA MEMORY CORP | 3 | 2017–2021 |
| JSR CORP | 2 | 2003 |
| YAMADA NOBUHIDEself | 2 | 2011–2013 |
| EMA TATSUHIKO | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 10 | 2002–2011 |
| Yokkaichi, JP | 3 | 2011 |
| Nagoya, JP | 2 | 2017–2018 |
| Mie, JP | 2 | 2013–2015 |
| Yokohama-shi, Kanagawa, JP | 1 | 2021 |