Inventor
Akihito Yamamoto
Inventor
Naka-gun, JP
Overview
Patents· 56 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices17%
H10DInorganic electric semiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
C23CCoating metallic material4%
C30BSingle-crystal growth4%
H10NElectric solid-state devices not otherwise provided for4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B60GVehicle suspension arrangements3%
H01LSemiconductor devices2%
PatentTitleYear
11,101,325Semiconductor memory and method of manufacturing the same202111,079,891Touch screen device202110,823,828Object capturing device202010,696,119Control apparatus of damping force variable damper, control system, and method202010,625,558Damping force control apparatus for suspension202010,611,115Tank cooling device202010,056,433Semiconductor memory and method of manufacturing the same20189,889,717'Damping force control apparatus of suspension'20189,450,181'Semiconductor memory and method of manufacturing the same'2016D0737163'Photoelectric sensor'20158,766,373'Semiconductor memory and method of manufacturing the same'20148,637,915'Nonvolatile semiconductor memory'20148,609,487'Method of manufacturing semiconductor device'20138,489,279'Damping force control apparatus'20138,324,679'Nonvolatile semiconductor memory'20128,278,697'Semiconductor device and method for manufacturing the same'20128,114,755'Method of manufacturing semiconductor device'20128,110,865'Semiconductor device and method for manufacturing the same'20128,017,989'Nonvolatile semiconductor memory device and method of manufacturing the same'20118,008,732'Semiconductor memory and method of manufacturing the same'20118,008,152'Method of manufacturing semiconductor device'20117,999,304'Semiconductor device'20117,982,259'Nonvolatile semiconductor memory'20117,954,939'Decurling mechanism'20117,927,949'Semiconductor memory device and method of manufacturing the same'20117,888,730'Nonvolatile semiconductor memory'20117,803,682'Semiconductor memory device and method for manufacturing same'20107,723,772'Semiconductor memory device and method of manufacturing the same'20107,682,899'Method of manufacturing semiconductor device'20107,635,890'Semiconductor device'20097,635,891'Semiconductor device'20097,612,404'Semiconductor device'20097,485,918'Semiconductor device and method for manufacturing the same'20097,195,930'Cleaning method for use in an apparatus for manufacturing a semiconductor device'20077,145,667'Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, semiconductor device manufacturing system, and cleaning method for semiconductor device manufacturing apparatus'20067,065,469'Manufacturing apparatus and method for predicting life of a manufacturing apparatus which uses a rotary machine'20066,992,020'Method of fabricating semiconductor device'20066,989,281'Cleaning method for a semiconductor device manufacturing apparatus'20066,946,304'Apparatus for and method of manufacturing a semiconductor device, and cleaning method for use in the apparatus for manufacturing a semiconductor device'20056,898,551'System for predicting life of a rotary machine, method for predicting life of a manufacturing apparatus which uses a rotary machine and a manufacturing apparatus'20056,841,850'Semiconductor device having silicon nitride film and silicon oxide film, and method of fabricating the same'20056,772,045'System for determining dry cleaning timing, method for determining dry cleaning timing, dry cleaning method, and method for manufacturing semiconductor device'20046,456,453'Magnetic disk drive in which a body including a chassis is rotatable with reference to a location displaced from the center of gravity of the body'20026,188,838'Apparatus for heat treating a semiconductor wafer to reduce stress'20016,171,977'Semiconductor device applied to composite insulative film manufacturing method thereof'20015,893,760'Method of heat treating a semiconductor wafer to reduce stress'19995,885,905'Semiconductor substrate and method of processing the same'19995,881,090'Quartz used in semiconductor manufacturing device, apparatus for manufacturing the quartz, and method for manufacturing the same'19995,838,056'Semiconductor device applied to composite insulative film and manufacturing method thereof'19985,750,436'Thermal processing method and apparatus therefor'19985,714,406'Method for forming film on semiconductor substrate by thermal CVD method'19985,619,305'Negative film masking apparatus for photographic printer'19975,502,010'Method for heat treating a semiconductor substrate to reduce defects'19965,484,484'Thermal processing method and apparatus therefor'19965,318,633'Heat treating apparatus'19945,094,469'Trailer hitch device for motor vehicles'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2016Patents assigned to TOSHIBA KK (41)· patent assignee history
1994–2021Based in Tokyo, JP· patent location history
1996–2010Based in Kanagawa, JP· patent location history
1998–2001Based in Yokkaichi, JP· patent location history
2004–2007Based in Yokohama, JP· patent location history
2009–2021Based in Naka-gun, JP· patent location history
2012–2014Patents assigned to YAMAMOTO AKIHITO (8)· patent assignee history
2012–2014Patents assigned to OZAWA YOSHIO (7)· patent assignee history
2012–2014Patents assigned to ARAI FUMITAKA (3)· patent assignee history
2013–2020Patents assigned to AISIN SEIKI (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 41 | 1994–2016 |
| YAMAMOTO AKIHITOself | 8 | 2012–2014 |
| OZAWA YOSHIO | 7 | 2012–2014 |
| AISIN SEIKI | 4 | 2013–2020 |
| ARAI FUMITAKA | 3 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Naka-gun, JP | 23 | 2009–2021 |
| Kanagawa, JP | 7 | 1996–2010 |
| Yokohama, JP | 7 | 2004–2007 |
| Yokkaichi, JP | 4 | 1998–2001 |
| Tokyo, JP | 2 | 1994–2021 |