Inventor
Tatsuhiko Ema
Inventor
Kamakura, JP
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
B05CApparatus for applying fluent materials to surfaces, in general18%
B05DProcesses for applying fluent materials to surfaces, in general15%
B05BSpraying apparatus12%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices12%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12%
G02BOptical elements, systems or apparatus3%
PatentTitleYear
8,071,157'Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus'20117,799,368'Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus'20107,669,608'Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzle'20107,604,832'Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus'20097,364,839'Method for forming a pattern and substrate-processing apparatus'20087,312,018'Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus'20077,067,033'Chemical liquid processing apparatus for processing a substrate'20067,018,481'Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzle'20066,842,281'Observation device, ultraviolet microscope and observation method'20056,800,569'Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus'20046,719,844'Deposition method, deposition apparatus, and pressure-reduction drying apparatus'20046,709,531'Chemical liquid processing apparatus for processing a substrate and the method thereof'20046,709,699'Film-forming method, film-forming apparatus and liquid film drying apparatus'20046,506,453'Deposition method, deposition apparatus, and pressure-reduction drying apparatus'20036,372,413'Method for cleaning the surface of substrate to which residues of resist stick'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2011Patents assigned to TOSHIBA KK (14)· patent assignee history
2002–2004Based in Kawasaki, JP· patent location history
2004–2011Based in Kamakura, JP· patent location history
2004–2006Based in Kanagawa, JP· patent location history
2006–2010Based in Somers, NY, US· patent location history
2011Patents assigned to EMA TATSUHIKO (1)· patent assignee history
2011Patents assigned to HAYASAKI KEI (1)· patent assignee history
2011Patents assigned to ITO SHINICHI (1)· patent assignee history
2011Patents assigned to NAKATA REMPEI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 14 | 2002–2011 |
| EMA TATSUHIKOself | 1 | 2011 |
| HAYASAKI KEI | 1 | 2011 |
| ITO SHINICHI | 1 | 2011 |
| NAKATA REMPEI | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kamakura, JP | 7 | 2004–2011 |
| Kawasaki, JP | 4 | 2002–2004 |
| Somers, New York, US | 2 | 2006–2010 |
| Kanagawa, JP | 2 | 2004–2006 |