LexDanaLexDanabeta
Inventor

Hiroshi Takebayashi

Inventor
Handa, JP

Overview

21→
Patents
2003–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 21 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H01LSemiconductor devices12%
Y10TTechnical subjects covered by former us classification9%
H05BElectric heating8%
C23CCoating metallic material7%
C22CAlloys5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
C21DModifying the physical structure of ferrous metals4%
H05KPrinted circuits4%
LOC134%
PatentTitleYear
10,774,412Hot-dip galvanized cold-rolled steel sheet and process for producing same202010,668,558Metal wiring bonding structure and production method therefor202010,609,818Integrated wiring board assembly202010,566,218Ceramic heater202010,483,146Electrostatic chuck heater201910,388,560Shaft-end mounting structure201910,332,774Wafer support structure201910,292,209Electrostatic chuck heater2019D0846513Sheet heater for electrostatic chuck201910,256,105Disc-shaped heater and heater-cooling-plate assembly2019D0843334Flexible printed circuits201910,029,328Metal wiring bonding structure and production method therefor2018D0821987Flexible printed circuits20189,976,196Hot-stamped steel20189,932,652Hot-stamped steel20189,593,796'Hot-dip galvanized steel pipe and method of manufacturing the same'20178,480,806'Bonding structure and semiconductor device manufacturing apparatus'20138,414,704'Bonding structure and semiconductor device manufacturing apparatus'20138,193,629'Bonding structure for a terminal of a susceptor of a semiconductor device manufacturing apparatus'20126,827,567'Powder compression molding method and apparatus and dry cell'20046,558,594'Powder compression molding method for producing cathode pellets for dry cells'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2004Based in Hirakata, JP· patent location history
2012–2020Patents assigned to NGK INSULATORS LTD (15)· patent assignee history
2012–2020Patents assigned to TAKEBAYASHI HIROSHI (4)· patent assignee history
2012–2013Patents assigned to FUJII TOMOYUKI (3)· patent assignee history
2012–2013Patents assigned to NAKAMURA TAICHI (3)· patent assignee history
2012–2019Based in Nagoya, JP· patent location history
2017–2018Patents assigned to NIPPON STEEL & SUMITOMO METAL CORP (3)· patent assignee history
2018–2020Based in Handa, JP· patent location history
2018Based in Tokai, JP· patent location history
2020Based in Osaka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NGK INSULATORS LTD152012–2020
TAKEBAYASHI HIROSHIself42012–2020
FUJII TOMOYUKI32012–2013
NAKAMURA TAICHI32012–2013
NIPPON STEEL & SUMITOMO METAL CORP32017–2018
Locations
LocationPatentsSpan
Handa, JP92018–2020
Nagoya, JP62012–2019
Tokai, JP22018
Hirakata, JP22003–2004
Osaka, JP12020