Inventor
Harry M. Siegel
Inventor
Hurst, TX, US
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
G06VImage or video recognition or understanding15%
H05KPrinted circuits14%
Y10TTechnical subjects covered by former us classification14%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy5%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution5%
Y02PClimate change mitigation technologies in the production or processing of goods3%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
PatentTitleYear
8,163,645'Method for providing a redistribution metal layer in an integrated circuit'20127,786,582'System for providing a redistribution metal layer in an integrated circuit'20107,595,017'Method for using a pre-formed film in a transfer molding process for an integrated circuit'20097,456,050'System and method for controlling integrated circuit die height and planarity'20087,202,110'Embedded flat film molding'20077,109,574'Integrated circuit package with exposed die surfaces and auxiliary attachment'20067,096,581'Method for providing a redistribution metal layer in an integrated circuit'20067,098,065'Integrated lid formed on MEMS device'20066,951,125'System and method for aligning an integrated circuit die on an integrated circuit substrate'20056,900,508'Embedded flat film molding'20056,785,137'Method and system for removing heat from an active area of an integrated circuit device'20046,771,500'System and method for direct convective cooling of an exposed integrated circuit die surface'20046,769,174'Leadframeless package structure and method'20046,762,470'Fingerprint sensor having a portion of the fluorocarbon polymer physical interface layer amorphized'20046,759,326'Method of making a semiconductor device having a planarized fluoropolymer passivating layer with selectively implanted charged particles'20046,707,093'Selective ionic implantation of fluoropolymer film to modify the sensitivity of underlying sensing capacitors'20046,700,190'Integrated circuit device with exposed upper and lower die surfaces'20046,693,441'Capacitive fingerprint sensor with protective coating containing a conductive suspension'20046,603,192'Scratch resistance improvement by filling metal gaps'20036,600,227'System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package'20036,372,543'Wrap-around interconnect for fine pitch ball grid array'20026,121,678'Wrap-around interconnect for fine pitch ball grid array'20005,994,774'Surface mountable integrated circuit package with detachable module and interposer'19995,724,728'Method of mounting an integrated circuit to a mounting surface'19985,642,265'Ball grid array package with detachable module'19975,610,800'Substrate mounting of circuit components with a low profile'19975,570,273'Surface mountable integrated circuit package with low-profile detachable module'19965,557,504'Surface mountable integrated circuit package with detachable module'19965,451,715'Molded package integrated circuit with electrochemical cell'1995D0359028'Socketed integrated circuit package'1995D0358806'Socketed integrated circuit package'1995D0358804'Detachable integrated circuit module'1995D0358805'Detachable integrated circuit module'1995D0354275'Low-profile detachable integrated circuit module'1995D0354274'Low-profile detachable integrated circuit module'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–1998Patents assigned to SGS THOMSON MICROELECTRONICS (6)· patent assignee history
1995Patents assigned to SGS THOMSON MICROELECTRONICS INC (6)· patent assignee history
1995–2012Based in Hurst, TX, US· patent location history
1999–2012Patents assigned to ST MICROELECTRONICS INC (22)· patent assignee history
2012Patents assigned to CHIU ANTHONY M (1)· patent assignee history
2012Patents assigned to DO BENTO VIEIRA ANTONIO A (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ST MICROELECTRONICS INC | 22 | 1999–2012 |
| SGS THOMSON MICROELECTRONICS | 6 | 1995–1998 |
| SGS THOMSON MICROELECTRONICS INC | 6 | 1995 |
| CHIU ANTHONY M | 1 | 2012 |
| DO BENTO VIEIRA ANTONIO A | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hurst, Texas, US | 35 | 1995–2012 |