USPatentGranted
S

Detachable integrated circuit module

Granted 30 May 1995 · no office action yet

Current assignee: Sgs-Thomson Microelectronics, Inc. · originally STMicroelectronics

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Inventors: Harry M. Siegel, Krishnan Kelappan, Michael J. Hundt · Examiner: Joel Sincavage · AU 291 · TC 2900

Application
Not granted yet
filed 2 Sep 1993
Publication
Not published
not published
Patent· this page
US D358804
granted 30 May 1995

Life of the patent

5 dated events
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Description

1 parts
›FIG. 1 is a perspective view of the…

FIG. 1 is a perspective view of the detachable integrated circuit module illustrating its cooperative relationship with a packaged integrated circuit. The broken line showing of the packaged integrated circuit is included for the purpose of illustrating an environmental element only, and forms no part of the claimed design;

FIGS. 2 and 3 are opposing side elevation views of the detachable module;

FIG. 4 is an end elevation view of the detachable module from its end nearer the lockout key;

FIG. 5 is an end elevation view of the detachable module from its end opposite that from the lockout key;

FIG. 6 is a top plan view of the detachable module; and,

FIG. 7 is a bottom plan view of the detachable module.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D13/182

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File wrapper

Pendency
1.7 y
635 days filing → grant
Office actions
0
on the grant's record
Examiner
Joel Sincavage
art unit 291 · TC 2900
Citations: 9 back · 0 forward

Chain of title

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Citations

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