Inventor

Naokatsu Kojima

Inventor

Shizuoka, JP

Overview

1991–2019

Patent span

Performing operations

Primary field (CPC B)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary

B23KSoldering or unsoldering33%

B24CAbrasive or related blasting with particulate material17%

B29CShaping or joining of plastics8%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds8%

F25CProducing, working or handling ice8%

H01RElectrically-conductive connections8%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

1991–2006Patents assigned to FUJI SEIKI MACHINE WORKS (4)· patent assignee history

1991–2001Based in Shizuoka, JP· patent location history

1992–1993Based in Sunto-gun, JP· patent location history

1993Patents assigned to FUJI SEIKI SEIZO SHO FUJI SEIK (1)· patent assignee history

2001Patents assigned to MAEKAWA SEISAKUSHO KK (1)· patent assignee history

2006Based in Nagaizumi-cho, JP· patent location history

2019Patents assigned to SENJU METAL INDUSTRY CO (1)· patent assignee history

2019Based in Tochigi, JP· patent location history

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
FUJI SEIKI MACHINE WORKS	4	1991–2006
FUJI SEIKI SEIZO SHO FUJI SEIK	1	1993
MAEKAWA SEISAKUSHO KK	1	2001
SENJU METAL INDUSTRY CO	1	2019

Locations