Continuous solder coating apparatus and its method

A continuous solder coating apparatus for an elongated lead frame having a plurality of semiconductor devices mounted at spaced intervals therealong with each semiconductor device having leads projecting outwardly from at least one pair of opposite sides, comprising: a solder coating unit including means defining a liquid solder bath, and a coating member positioned over said bath so that a lower portion of said member is immersed in said bath and an upper portion of said member is disposed above said bath; said upper portion having a tunnel-like solder coating passage extending horizontally therethrough and defined between generally opposed top and bottom walls, said passage having a cross section which substantially corresponds to the cross section of the lead frame and includes a channel-like groove of enlarged cross section for accommodating a plastic package which encloses the semiconductor device and a pair of narrow slit-like passages which project horizontally outwardly from opposite sides of said groove for accommodating leads which project from opposite sides of the package; said coating member including a plurality of slit-like slots of narrow width projecting vertically thereof, each of said slots having a lower end which opens through the lower portion of the coating member for direct communication with the solder bath, and each of said slots having an upper end which opens upwardly in direct communication with one of the slit-like passages, each slit-like passage having at least one of said slit-like slots communicating therewith for feeding solder upwardly to the slit-like passage by capillary action; a flux coating device for applying a flux solution to opposite surfaces of the lead frame; transfer means for supporting the lead frame in a horizontal orientation and for moving it from the flux coating device to the solder coating unit and for effecting horizontal movement of the horizontally-oriented lead frame into and through the coating passage to effect solder coating of upper and lower surfaces of the leads.

An apparatus for solder coating a lead frame having a plurality of semiconductor devices mounted thereon at spaced intervals therealong and each having a plastic package which projects vertically from the lead frame and a plurality of leads which project horizontally outwardly from the package with said leads including laterally directed leads which project outwardly from one pair of opposite sides of the package and longitudinally directed leads which project outwardly from another pair of opposite sides of the package, said apparatus comprising: a first flux coating device for applying a flux solution to opposite surfaces of the leads which project outwardly from a first pair of opposite sides of the package; a first solder coating device for simultaneously solder coating upper and lower surfaces of the lead which project outwardly in opposite directions from the first pair of opposite sides of the package; a second flux coating device for applying a flux solution to upper and lower surfaces of the leads which project outwardly from a second pair of opposite sides of the package; a second solder coating device for effecting simultaneous solder coating of the upper and lower surfaces of both of the leads which project outwardly from said second pair of opposite sides; each of said solder coating devices including a bath containing liquid solder, and a solder coating block having an upper portion disposed above said bath and a lower portion projecting downwardly into the bath, the upper portion having a tunnel-like coating passage extending horizontally therethrough and defined between opposed top and bottom walls for permitting horizontal movement of the lead frame therethrough, said coating passage including an enlarged channel-like groove extending longitudinally thereof for accommodating the package on the lead frame and a pair of vertically narrow slit-like passages disposed on horizontally opposite sides of and projecting sidewardly from the channel-like groove for receiving therein the leads which project outwardly from opposite sides of the package, and a pair of generally vertically-extending slit-like slot means formed in said coating block for feeding solder upwardly by capillary action from said bath to said slit-like passages, said slit-like slot means at upper ends communicating with said slit-like passages and at lower ends communicating directly with said bath; said coating passage as associated with the coating block of one said coating device being transversely horizontally elongated and having a plurality of sidewardly-spaced said channel-like grooves extending therealong in correspondence with the number of packages provided on the lead frame for permitting the lead frame to be moved horizontally through the coating passage in a lateral or sideward direction of the lead frame; and said coating passage associated with the coating block of the other coating device having only a single said channel-like groove associated therewith for permitting horizontal movement of the lead frame through the coating passage in the longitudinal direction of the lead frame.

A solder coating process comprising the steps of: providing an elongate lead frame formed generally as a thin metal strip having a plurality of semiconductor devices mounted thereon at longitudinally spaced intervals, each semiconductor device being enclosed in an enlarged plastic package which projects outwardly from opposite sides of the strip, the lead frame including first and second pairs of metal leads associated with each said package, the first pair of metal leads projecting outwardly in opposite directions from a first pair of opposite sides of the package so that the leads of said first pair project in the longitudinal direction of the lead frame, and the second pair of metal leads projecting outwardly in opposite directions from a second pair of opposite sides of the package so that the leads of said second pair project sidewardly relative to the longitudinal direction of the lead frame; providing a first solder coating device which includes a first solder coating block which projects downwardly for immersion into a solder bath and which has an upper portion disposed above the bath and has a first tunnel-like solder coating passage extending horizontally therethrough, the first solder coating passage having a transverse vertical cross section which substantially corresponds to the longitudinal cross section of the lead frame; imersing said lead frame into a flux solution bath to remove oxide film from the lead frame and to activate the lead frame surfaces; then horizontally orienting the lead frame and moving the lead frame horizontally in a sideward direction which is generally perpendicular to said elongated direction so as to move the lead frame into and through the first tunnel-like coating passage; supplying solder material upwardly by capillary action from the solder bath through a plurality of sidewardly-spaced narrow slits to sidewardly-spaced portions of the first coating passage for simultaneously coating upper and lower sides of all longitudinally extending leads of said lead frame as the lead frame moves sidewardly through the first coating passage; providing a second solder coating device having a solder bath and a second solder coating block having a lower portion immersed in the bath and an upper portion disposed above the bath and provided with a second tunnel-like coating passage extending horizontally therethrough, said second coating passage having a transverse vertical cross section which substantially corresponds to the sideward cross section of the lead frame as taken through one of said plastic packages; applying a flux coating solution to the upper and lower surfaces of the sidewardly-projecting leads after the longitudinally-projecting leads have been solder coated; then moving the horizontally-oriented lead frame horizontally in its elongated direction into and through the second coating passage; and solder coating the upper and lower surfaces of the sidewardly-extending leads disposed at opposite sides of the packages by feeding solder upwardly by capillary action from the bath through vertically upwardly extending narrow slits which communicate with vertically-narrow portions of said second solder coating passage at locations disposed adjacent opposite sides thereof.