Inventor

Takuya Suzuki

Inventor

Tokyo, JP

Overview

1976–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 84 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%

H01PWaveguides7%

Y10TTechnical subjects covered by former us classification7%

F16KValves5%

H10DInorganic electric semiconductor devices4%

C08LCompositions of macromolecular compounds3%

H05KPrinted circuits3%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%

G01NInvestigating or analysing materials by determining their chemical or physical properties3%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%

PatentTitleYear

10,876,705Light emitting module2020 10,823,718Gas alarm, control device and program2020 10,755,672Playback device2020 10,670,223Light emitting module2020 10,653,586Curable composition, curable composition for dental use, and organic-inorganic composite particles for dental use2020 10,655,746Solenoid valve2020 10,648,961Core-shell type catalyst and gas sensor including the catalyst2020 10,640,639Polymer and asphalt composition2020 10,625,767Steering device2020 10,601,147Method of bonding core wire and bonding object, ultrasonic bonding device, and junction between core wire and bonding object2020 10,547,581Electronic mail erroneous transmission prevention supporting device and electronic mail erroneous transmission prevention supporting method2020 10,428,962Valve device2019 10,414,653Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheet2019 10,370,251Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheet2019 10,352,244Combustor cooling structure2019 10,217,970Steel plate for forming battery can and alkaline battery2019 10,138,319Polymer and asphalt composition2018 10,106,413Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheet2018 9,945,803Gas detecting device and method thereof2018 9,939,475Phase frequency detection device2018 9,929,417'Valve device'2018 9,910,023'Gas sensor'2018 9,862,793'Method for producing a polymer, polymer solution and polymer'2018 9,738,742'Method for producing polymer'2017 9,693,492'High-frequency package'2017 9,648,725'High-frequency circuit package and sensor module'2017 9,581,172'Method for manufacturing turbocharger bearing housing, and turbocharger bearing housing'2017 9,433,080'High-frequency circuit package and sensor module'2016 9,400,506'Pressure reducer'2016 9,315,959'Foreign matter removing apparatus at track branch, and nozzle used in the same'2016 9,267,079'Phosphorus-free based halogen-free flame-retardant resin composition, phosphorus-free based halogen-free flame-retardant insulated electric wire and phosphorus-free based halogen-free flame-retardant cable'2016 9,156,979'Insulated wire using a resin composition'2015 9,070,961'High-frequency circuit package and sensor module'2015 8,548,416'Semiconductor chip and radio frequency circuit'2013 8,474,792'Valve device and manually operated shutoff valve device'2013 8,445,785'Polybutylene naphthalate-based resin composition and electric wire using the polybutylene naphthalate-based resin composition'2013 8,415,140'Analysis device, and analysis apparatus and method using the same'2013 8,408,243'Valve device'2013 8,358,185'Waveguide connection between a dielectric substrate and a waveguide substrate having a choke structure in the dielectric substrate'2013 8,316,877'Component holding device'2012 8,289,529'Analyzing apparatus'2012 8,229,387'Even harmonic mixer'2012 8,179,214'Waveguide connection between a multilayer waveguide substrate and a metal waveguide substrate including a choke structure in the multilayer waveguide'2012 8,151,819'Fluid supply valve attachment device'2012 8,104,508'Valve device assembling structure, plug body, and manual valve'2012 8,052,119'Valve device'2011 8,040,286'High frequency module'2011 8,035,994'High frequency storing case and high frequency module'2011 8,028,716'Pressure-reducing valve'2011 7,994,881'Waveguide connection between a multilayer waveguide substrate and a metal waveguide substrate including a choke structure in the multilayer waveguide'2011 7,964,937'Multilayer dielectric substrate and semiconductor package'2011 7,880,256'Semiconductor device with passivation layer covering wiring layer'2011 7,847,644'Modulation signal generation circuit, transmission/reception module, and radar device'2010 7,756,503'High frequency module'2010 7,725,009'Battery driven video reproduction apparatus'2010 7,609,592'Reproduction apparatus and method capable of calculating error between designated time point and time stamp'2009 7,504,710'Multilayer dielectric substrate and semiconductor package'2009 7,498,907'Transmission line substrate and semiconductor package'2009 7,495,706'Video signal setting device for performing output setting to a display device'2009 7,475,327'Optical disc recording and reproducing apparatus'2009 7,344,332'Spacer suitable for use with disk brake including caliper'2008 7,336,221'High frequency package, transmitting and receiving module and wireless equipment'2008 7,217,998'Semiconductor device having a heat-dissipation member'2007 7,164,905'High frequency module'2007 7,161,210'Semiconductor device with source and drain regions'2007 7,056,797'Semiconductor device and method of manufacturing the same'2006 6,876,846'High frequency module'2005 6,842,858'Mechanism for updating firmware of an electronic device'2005 6,740,932'Semiconductor device for improving sustaining voltage'2004 6,713,331'Semiconductor device manufacturing using one element separation film'2004 6,696,734'LDD high voltage MOS transistor'2004 6,614,075'Semiconductor device and method of manufacturing the same'2003 6,599,782'Semiconductor device and method of fabricating thereof'2003 6,278,451'Image processor'2001 6,255,154'Semiconductor device and method of manufacturing the same'2001 5,696,519'Polarization angle adjustment apparatus for transmitter and receiver equipment'1997 5,576,670'Branching filter for transmitter-receiver'1996 5,495,668'Manufacturing method for a supermicro-connector'1996 5,266,416'Aluminum-stabilized superconducting wire'1993 5,228,928'Method of manufacturing Nb.sub.3 Sn superconducting wire'1993 4,421,946'High current capacity superconductor'1983 4,420,655'Circuit to compensate for deficit of output characteristics of a microphone by output characteristics of associated other microphones'1983 4,078,299'Method of manufacturing flexible superconducting composite compound wires'1978 3,983,521'Flexible superconducting composite compound wires'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1976–2018Based in Kawasaki, JP· patent location history

1993–2020Based in Tokyo, JP· patent location history

2001–2011Patents assigned to SANYO ELECTRIC CO (9)· patent assignee history

2001–2007Based in Saitama, JP· patent location history

2005–2018Patents assigned to MITSUBISHI ELECTRIC CORP (20)· patent assignee history

2005–2020Patents assigned to FUNAI ELECTRIC CO (6)· patent assignee history

2011–2020Patents assigned to JTEKT CORP (11)· patent assignee history

2011–2020Based in Anjo, JP· patent location history

2012–2017Patents assigned to SUZUKI TAKUYA (18)· patent assignee history

2018–2020Based in Hachioji, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MITSUBISHI ELECTRIC CORP	20	2005–2018
SUZUKI TAKUYAself	18	2012–2017
JTEKT CORP	11	2011–2020
SANYO ELECTRIC CO	9	2001–2011
FUNAI ELECTRIC CO	6	2005–2020

Locations

Location	Patents	Span
Tokyo, JP	32	1993–2020
Anjo, JP	11	2011–2020
Saitama, JP	8	2001–2007
Kawasaki, JP	4	1976–2018
Hachioji, JP	3	2018–2020