Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheet
Granted 6 Aug 2019 · 2 office actions
Current assignee: MITSUBISHI CHEMICAL CORPORATION · originally Mitsubishi Electric Corporation
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Inventors: Kazuki Takeda, Takuya Suzuki, Katsura Ikemiya, Masanori Yamazaki +3 · Examiner: Shane Fang · AU 1766 · TC 1700
Life of the patent
8 dated eventsAbstract
The present invention addresses the problem of providing agglomeraterd boron nitride particles which are suitable to be used as a thermally conductive filler for a heat dissipation sheet of a power semiconductor device, and which exhibit excellent isotropy of thermal conductivity, excellent degradation resistance, and excellent kneadability with respect to resin. The agglomerated boron nitride particles are obtained by agglomerating boron nitride primary particles. The agglomerated BN articles are characterized in that: a peak area intensity ratio ((100)/(004)) of a (100) plane to a (004) plane of the BN primary particles is 0.25 or more, and the average crystallite size of the BN primary particles obtained from a (002) plane peak of the BN primary particles is 375 Å or more.
Claims
12 · 2 independent · depth 3Classifications
4 codes- C08K3/38
- C01B21/064
- C09K5/14
- C08L101/00
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1 priority documents›Priority documents — 1
| Type | Document | Date |
|---|---|---|
| related publication | US 20180354793 A1 | 13 Dec 2018 |
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