USPatentGranted
B2

Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheet

Granted 6 Aug 2019 · 2 office actions

Current assignee: MITSUBISHI CHEMICAL CORPORATION · originally Mitsubishi Electric Corporation

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Inventors: Kazuki Takeda, Takuya Suzuki, Katsura Ikemiya, Masanori Yamazaki +3 · Examiner: Shane Fang · AU 1766 · TC 1700

Life of the patent

8 dated events
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Abstract

The present invention addresses the problem of providing agglomeraterd boron nitride particles which are suitable to be used as a thermally conductive filler for a heat dissipation sheet of a power semiconductor device, and which exhibit excellent isotropy of thermal conductivity, excellent degradation resistance, and excellent kneadability with respect to resin. The agglomerated boron nitride particles are obtained by agglomerating boron nitride primary particles. The agglomerated BN articles are characterized in that: a peak area intensity ratio ((100)/(004)) of a (100) plane to a (004) plane of the BN primary particles is 0.25 or more, and the average crystallite size of the BN primary particles obtained from a (002) plane peak of the BN primary particles is 375 Å or more.

Claims

12 · 2 independent · depth 3
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12 granted claims

Classifications

4 codes
IPC · International Patent Classification
Section C — Chemistry; metallurgy
  • C08K3/38
  • C01B21/064
  • C09K5/14
  • C08L101/00

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File wrapper

⤢ drag to zoomJul 2018Oct 2018Jan 2019Apr 2019Jul 2019Oct 2019USPTOApplicantRestriction requirementNon-final rejectionResponse after non-final
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Pendency
1.0 y
350 days filing → grant
Office actions
1
after a restriction
Responses
1
no RCE
Examiner
Shane Fang
art unit 1766 · TC 1700
Citations: 52 back · 0 forward

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20180354793 A113 Dec 2018

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