Inventor

Lung-Hsin Chen

Inventor
Hsinchu, TW

Overview

69→
Patents
2000–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 69 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Hprimary
H10HInorganic light-emitting semiconductor devices having potential barriers28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H01LSemiconductor devices20%
LOC135%
H10DInorganic electric semiconductor devices5%
F21VFunctional features or details of lighting devices or systems thereof4%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted4%
F21KNon-electric light sources using luminescence2%
G02BOptical elements, systems or apparatus2%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein1%
PatentTitleYear
10,705,376Liquid crystal display device2020D0887588Light-emitting diode with refracting lens2020D0887589Light-emitting diode with reflecting lens202010,222,024Lens for light emitting device201910,133,133Liquid crystal display base20189,899,587'Lead frame and light emitting diode package having the same'20189,842,968'LED package'20179,786,642'Light emitting diode package substrate and light emitting diode package element'20179,746,162'Light emitting diode bulb'20179,666,568'Photoelectric device and method of manufacturing the same'20179,660,144'LED package and LED die'20179,640,742'LED package with reflecting cup'20179,620,692'Lead frame and light emitting diode package having the same'20179,543,482'LED package'20179,543,283'Light emitting diode package and method for manufacturing same'20179,543,486'LED package with reflecting cup'20179,496,246'Light emitting diode package and method for manufacturing same'20169,465,205'Optical lens and backlight module incorporating the same'20169,437,585'Photoelectric device and method of manufacturing the same'20169,431,591'LED package with reflecting cup'2016D0763206'Light emitting diode package'2016D0763207'Light emitting diode package'20169,406,842'Flip chip light emitting diode packaging structure'20169,324,702'Photoelectric device'20169,318,666'Light emitting diode device and method for manufacturing same'20169,184,358'Lead frame and light emitting diode package having the same'20159,147,809'Flip chip light emitting diode packaging structure'20159,070,842'Light-emitting diode manufacturing method'20159,065,028'Flip-chip light emitting diode package with moisture barrier layer'20159,048,408'Light emitting diode package'20159,048,394'Light emitting diode package with oxidation-resistant metal coating layer'20159,040,321'Method for manufacturing light emitting diode packages'20159,041,022'Light emitting diode package and method for manufacturing the same'20159,018,668'Light emitting diode package'20159,012,248'Method for packaging light emitting diode'20158,981,447'Light emitting diode package'20158,979,312'Light emitting diode bulb'20158,960,955'LED lamp having a large illumination angle'20158,956,893'Metiod of making LED with bat-wing emitting field lens'20158,921,131'Method for manufacturing light emitting diode package'20148,906,715'Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the same'20148,883,533'Method for manufacturing light emitting diode package'20148,853,733'Light emitting diode package and method for manufacturing the same'20148,846,422'Method for manufacturing LED package struture and method for manufacturing LEDs using the LED packange struture'20148,828,755'Light-emitting element package and fabrication method thereof'20148,822,277'Method for manufacturing light emitting diode package'20148,809,083'Method of manufacturing light emitting diode'20148,791,493'Light emitting diode package and method for manufacturing the same'20148,772,062'Method for manufacturing light emitting diode package having LED die fixed by anisotropic conductive paste'20148,658,445'Method for manufacturing phosphor film and method for making LED package having the phosphor film'20148,541,799'Light-emitting element package and fabrication method thereof'20138,470,621'Method for fabricating a flip-chip semiconductor optoelectronic device'20138,384,276'LED lamp structure'20138,344,406'Light emitting diode package and manufacturing method thereof'20138,270,444'Side emitting semiconductor package'2012D0654444'LED module'2012D0644189'LED light bar'2011D0642995'LED light bar'2011D0642994'LED light bar'2011D0642998'LED module'20117,994,628'Package structure of photoelectronic device and fabricating method thereof'20117,989,237'Package structure for solid-state lighting devices and method of fabricating the same'2011D0642545'LED light bar'2011D0640212'LED light bar'20117,719,099'Package structure for solid-state lighting devices and method of fabricating the same'20107,508,007'Package structure of light-emitting diode'20096,621,522'Adjustable fixing device of a CCD plate'20036,268,225'Fabrication method for integrated passive component'20016,083,766'Packaging method of thin film passive components on silicon chip'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2020Based in Hsinchu, TW· patent location history
2003–2012Based in Taipei, TW· patent location history
2009–2020Patents assigned to ADVANCED OPTOELECTRONIC TECH (59)· patent assignee history
2009–2013Based in Hsinchu County, TW· patent location history
2010–2011Based in Jhudong Township, TW· patent location history
2012–2015Patents assigned to CHEN LUNG-HSIN (10)· patent assignee history
2012–2015Patents assigned to TSENG WEN-LIANG (9)· patent assignee history
2012–2013Patents assigned to HSIEH MIN-TSUN (5)· patent assignee history
2012–2013Patents assigned to LIN CHIH-YUNG (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ADVANCED OPTOELECTRONIC TECH592009–2020
CHEN LUNG-HSINself102012–2015
TSENG WEN-LIANG92012–2015
HSIEH MIN-TSUN52012–2013
LIN CHIH-YUNG52012–2013
Locations
LocationPatentsSpan
Hsinchu, TW572000–2020
Taipei, TW72003–2012
Hsinchu County, TW32009–2013
Jhudong Township, TW22010–2011