An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein.

Claims

8 · 1 independent · depth 4

8 granted claims

›1.independentA light emitting diode (LED) packaging comprising:na substrate having a top surface and a bottom surface opposite to the top surface, a recess defined…+7

›2.↳ 1The LED package of claim 1, wherein an insulating layer is sandwiched between the first electrode and the second electrode.d2+3

›6.↳ 1The LED package of claim 1, wherein a top surface of the reflecting layer is coplanar with the top surface of the substrate.d2

›7.↳ 1The LED package of claim 1, wherein the reflecting layer is opaque and comprises reflection particle.d2

›8.↳ 1The LED package of claim 1, wherein a packaging layer is formed on the top surface of the substrate and covers the LED and the reflecting layer.d2

Classifications

3 codes

IPC · International Patent Classification

Section H — Electricity

H01L25/16
H01L33/00
H01L33/48

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Pendency

2.4 y

879 days filing → grant

Office actions

after a restriction

Responses

no RCE

Examiner

Hoa B Trinh

art unit 2817 · TC 2800

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Citations: 2 back · 0 forward

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20150054009 A1	26 Feb 2015

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