Inventor
Masaru Takada
Inventor
Ogaki, JP
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification18%
F24FAir-conditioning13%
H05KPrinted circuits13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact11%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application10%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
B29CShaping or joining of plastics2%
B60HArrangements of heating, cooling, ventilating or other air-treating devices specially adapted for passenger or goods spaces of vehicles2%
PatentTitleYear
10,451,299Humidifier and air-conditioning apparatus including humidifier201910,352,629Heat exchange element201910,202,511Hydrophilic coating film, method for producing same, humidification element, and humidification device20199,903,669'Heat exchange element and air conditioner'20189,863,710'Laminated total heat exchange element'20189,816,715'Humidifier and air-conditioning apparatus with humidifier'20179,777,935'Humidifier and air-conditioning apparatus including the same'20179,664,452'Heat exchange element'20179,664,457'Total heat exchange element and manufacturing method thereof'20179,161,445'Printed wiring board and method for manufacturing printed wiring board'20159,049,808'Printed wiring board and a method of manufacturing a printed wiring board'20158,726,978'Heat exchanger element and heat exchanger'20148,689,859'Total heat exchanging element and total heat exchanger'20148,607,851'Total heat exchanging element and total heat exchanger'20138,590,606'Heat exchange element and manufacturing method thereof, heat exchanger, and heat exchange ventilator'20138,528,200'Printed wiring board and method for manufacturing printed wiring board'20138,316,542'Method of manufacturing total heat exchange element and total heat exchange element'20127,765,692'Method of manufacturing printed wiring board'20107,612,295'Printed wiring board and method for manufacturing the same'20097,594,320'Method of manufacturing printed wiring board'20097,552,531'Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit'20097,339,118'Printed wiring board and method for manufacturing the same'20087,320,361'Heat exchanger'20087,299,862'Total heat exchanging element'20076,986,917'Printed wiring board and method of manufacturing the same'20066,825,421'Printed wiring board and method for manufacturing the same'20046,715,204'Printed wiring board and method for producing the same'20046,590,165'Printed wiring board having throughole and annular lands'20036,555,208'Printed wiring board and method of manufacturing the same'20036,284,353'Printed wiring board and method of manufacturing the same'20016,228,466'Printed wiring board and method for manufacturing the same'20015,914,859'Electronic component mounting base board and method of producing the same'19994,900,385'Method for forming container'19904,663,107'Method for the production of thermoplastic tubes'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–1990Based in Nara, JP· patent location history
1999–2015Patents assigned to IBIDEN CO LTD (15)· patent assignee history
1999Based in Ohgaki, JP· patent location history
2001–2015Based in Ogaki, JP· patent location history
2007–2019Patents assigned to MITSUBISHI ELECTRIC CORP (16)· patent assignee history
2007–2019Based in Tokyo, JP· patent location history
2012–2018Patents assigned to TAKADA MASARU (11)· patent assignee history
2012–2017Patents assigned to ARAI HIDEMOTO (7)· patent assignee history
2012–2018Patents assigned to IMAI TAKANORI (7)· patent assignee history
2017–2019Based in Chiyoda-ku, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 16 | 2007–2019 |
| IBIDEN CO LTD | 15 | 1999–2015 |
| TAKADA MASARUself | 11 | 2012–2018 |
| ARAI HIDEMOTO | 7 | 2012–2017 |
| IMAI TAKANORI | 7 | 2012–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ogaki, JP | 15 | 2001–2015 |
| Tokyo, JP | 9 | 2007–2019 |
| Chiyoda-ku, JP | 7 | 2017–2019 |
| Nara, JP | 2 | 1987–1990 |
| Ohgaki, JP | 1 | 1999 |