USPatentGranted
B1

Printed wiring board and method for manufacturing the same

Granted 30 Nov 2004 · 14 office actions

Application
9380994
filed 13 Sep 1999
Publication
Not published
not published
Patent· this page
US 6,825,421
granted 30 Nov 2004

Life of the patent

23 dated events
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Abstract

In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is connected to external connecting terminals (7). The second to (n1)-th conductive layers (12) are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Classifications

6 codes
IPC · International Patent Classification
Section H — Electricity
  • H05K1/03
USPC · US Patent Classification
174/255174/26229/83029/832174/260

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File wrapper

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Pendency
5.2 y
1,905 days filing → grant
Office actions
7
after a restriction
Responses
7
2 RCE
Examiner
Kamand Cuneo
art unit —
Citations: 20 back · 0 forward

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