Printed wiring board and method for manufacturing the same
Granted 30 Nov 2004 · 14 office actions
Assignee: Ibiden Co., Ltd.
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Hiroyuki Kobayashi, Kiyotaka Tsukada, Mitsuhiro Kondo, Hisashi Minoura +1 · Examiner: Kamand Cuneo
Life of the patent
23 dated eventsAbstract
In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is connected to external connecting terminals (7). The second to (n1)-th conductive layers (12) are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.
Classifications
6 codes- H05K1/03
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