Inventor
Kiyoaki Hashimoto
Inventor
Kanagawa, JP
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H01LSemiconductor devices33%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation13%
B23KSoldering or unsoldering5%
H05KPrinted circuits5%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
10,833,044Package-on-package assembly with wire bonds to encapsulation surface202010,593,643Package-on-package assembly with wire bonds to encapsulation surface202010,090,276Semiconductor package to reduce warping201810,062,661Package-on-package assembly with wire bonds to encapsulation surface20189,786,611'Method for manufacturing a semiconductor package'20179,716,075'Semiconductor chip assembly and method for making same'20179,691,731'Package-on-package assembly with wire bonds to encapsulation surface'20179,418,944'Semiconductor package'20169,337,165'Method for manufacturing a fan-out WLP with package'20169,224,717'Package-on-package assembly with wire bonds to encapsulation surface'20159,137,903'Semiconductor chip assembly and method for making same'20159,093,435'Package-on-package assembly with wire bonds to encapsulation surface'20158,969,133'Package-on-package assembly with wire bonds to encapsulation surface'20158,890,304'Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material'20148,618,659'Package-on-package assembly with wire bonds to encapsulation surface'20138,525,338'Chip with sintered connections to package'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2020Patents assigned to TESSERA INC (12)· patent assignee history
2013–2015Patents assigned to HABA BELGACEM (4)· patent assignee history
2013–2015Patents assigned to HASHIMOTO KIYOAKI (4)· patent assignee history
2013–2015Patents assigned to MASUDA NORIHITO (4)· patent assignee history
2013–2015Patents assigned to MOHAMMED ILYAS (4)· patent assignee history
2013–2020Based in Kanagawa, JP· patent location history
2013–2016Based in Yokohama, JP· patent location history
2016–2018Based in Ishikawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TESSERA INC | 12 | 2013–2020 |
| HABA BELGACEM | 4 | 2013–2015 |
| HASHIMOTO KIYOAKIself | 4 | 2013–2015 |
| MASUDA NORIHITO | 4 | 2013–2015 |
| MOHAMMED ILYAS | 4 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 9 | 2013–2020 |
| Yokohama, JP | 4 | 2013–2016 |
| Ishikawa, JP | 3 | 2016–2018 |