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Inventor

Takehiro Ueda

Inventor
Kanagawa, JP

Overview

43→
Patents
2000–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 43 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H01LSemiconductor devices11%
H10DInorganic electric semiconductor devices8%
C23CCoating metallic material7%
H01JElectric discharge tubes or discharge lamps7%
G11CStatic stores6%
Y10TTechnical subjects covered by former us classification5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
B60LPropulsion of electrically-propelled vehicles1%
PatentTitleYear
10,938,226Power control device202110,423,051Camera module201910,396,153Semiconductor device and method of manufacturing semiconductor device201910,396,190Semiconductor device and method of manufacturing semiconductor device201910,135,435Switching device with surge recirculation device and surge recirculation line20189,728,381'Plasma processor and plasma processing method'20179,620,449'Semiconductor device having a fuse element'20179,437,402'Plasma processor and plasma processing method'20169,177,912'Semiconductor device having a fuse element'20159,000,559'Semiconductor device, method of cutting electrical fuse, and method of determining electrical fuse state'20158,904,957'Plasma processor and plasma processing method'20148,869,376'Substrate mounting table and method for manufacturing same, substrate processing apparatus, and fluid supply mechanism'20148,871,592'Method of manufacturing a semiconductor device including concave portion'20148,742,465'Semiconductor device'20148,610,178'Semiconductor device having a fuse element'20138,573,836'Apparatus and method for evaluating a substrate mounting device'20138,491,752'Substrate mounting table and method for manufacturing same, substrate processing apparatus, and fluid supply mechanism'20138,476,701'Semiconductor device with gate electrode including a concave portion'20138,387,562'Plasma processor and plasma processing method'20138,372,730'Method for cutting an electric fuse'20138,362,524'Semiconductor device having a fuse element'20138,299,569'Semiconductor device and method of cutting electrical fuse'20128,236,622'Method for cutting electric fuse'20128,056,503'Plasma procesor and plasma processing method'20117,998,798'Method of cutting electrical fuse'20117,994,544'Semiconductor device having a fuse element'20117,989,913'Semiconductor device and method for cutting electric fuse'20117,835,211'Semiconductor device and method of fabricating the same'20107,795,699'Semiconductor device'20107,728,407'Semiconductor device and method of cutting electrical fuse'20107,679,871'Semiconductor device and method for determining fuse state'20107,646,581'Electrostatic chuck'20107,635,907'Semiconductor device with electric fuse having a flowing-out region'20097,619,264'Semiconductor device'20097,592,261'Method for suppressing charging of component in vacuum processing chamber of plasma processing system and plasma processing system'20097,529,147'Semiconductor device and method of fabricating the same'20097,515,497'Semiconductor device'20097,489,230'Semiconductor device and method of manufacturing the same'20097,411,851'Semiconductor device'20087,376,036'Semiconductor device including fuse and method for testing the same capable of suppressing erroneous determination'20087,282,751'Semiconductor device'2007D0553104'Absorption board for an electric chuck used in semiconductor manufacture'20076,143,592'MOS semiconductor device and method of fabricating the same'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2021Based in Tokyo, JP· patent location history
2007–2010Patents assigned to NEC ELECTRONICS CORP (12)· patent assignee history
2007–2017Patents assigned to TOKYO ELECTRON LTD (11)· patent assignee history
2007–2017Based in Kanagawa, JP· patent location history
2007–2013Based in Nirasaki, JP· patent location history
2008–2015Based in Kawasaki, JP· patent location history
2009–2017Based in Yamanashi, JP· patent location history
2011–2019Patents assigned to RENESAS ELECTRONICS CORP (17)· patent assignee history
2011–2015Patents assigned to UEDA TAKEHIRO (10)· patent assignee history
2011–2013Patents assigned to OOHASHI KAORU (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
RENESAS ELECTRONICS CORP172011–2019
NEC ELECTRONICS CORP122007–2010
TOKYO ELECTRON LTD112007–2017
UEDA TAKEHIROself102011–2015
OOHASHI KAORU42011–2013
Locations
LocationPatentsSpan
Kanagawa, JP212007–2017
Nirasaki, JP62007–2013
Tokyo, JP52000–2021
Yamanashi, JP52009–2017
Kawasaki, JP52008–2015