Inventor
Jingbin Feng
Inventor
Lake Oswego, OR, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C25Dprimary
C25DProcesses for the electrolytic or electrophoretic production of coatings30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
C23CCoating metallic material9%
C25FProcesses for the electrolytic removal of materials from objects7%
H01LSemiconductor devices7%
Y10TTechnical subjects covered by former us classification6%
H10DInorganic electric semiconductor devices4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
LOC131%
PatentTitleYear
10,711,364Uniform flow behavior in an electroplating cell202010,435,807Lipseals and contact elements for semiconductor electroplating apparatuses201910,351,968Front referenced anode201910,053,792Plating cup with contoured cup bottom20189,988,734Lipseals and contact elements for semiconductor electroplating apparatuses20189,945,044Method for uniform flow behavior in an electroplating cell20189,816,194'Control of electrolyte flow dynamics for uniform electroplating'20179,677,188'Electrofill vacuum plating cell'20179,512,538'Plating cup with contoured cup bottom'20169,340,893'Front referenced anode'20169,309,604'Method and apparatus for electroplating'20169,228,270'Lipseals and contact elements for semiconductor electroplating apparatuses'20169,028,657'Front referenced anode'20158,540,857'Plating method and apparatus with multiple internally irrigated chambers'20138,475,637'Electroplating apparatus with vented electrolyte manifold'20138,475,636'Method and apparatus for electroplating'20138,475,644'Method and apparatus for electroplating'2013D0668211'Segmented electroplating anode and anode segment'20128,262,871'Plating method and apparatus with multiple internally irrigated chambers'20128,257,781'Electroless plating-liquid system'20128,172,646'Magnetically actuated chuck for edge bevel removal'20127,690,324'Small-volume electroless plating cell'20106,967,174'Wafer chuck for use in edge bevel removal of copper from silicon wafers'20056,713,122'Methods and apparatus for airflow and heat management in electroless plating'20046,193,859'Electric potential shaping apparatus for holding a semiconductor wafer during electroplating'20016,159,354'Electric potential shaping method for electroplating'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2019Patents assigned to NOVELLUS SYSTEMS INC (23)· patent assignee history
2000–2001Based in Tigard, OR, US· patent location history
2004–2020Based in Lake Oswego, OR, US· patent location history
2012–2016Patents assigned to FENG JINGBIN (11)· patent assignee history
2012–2016Patents assigned to HE ZHIAN (7)· patent assignee history
2012–2016Patents assigned to GHONGADI SHANTINATH (4)· patent assignee history
2017–2020Patents assigned to LAM RES CORP (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NOVELLUS SYSTEMS INC | 23 | 2000–2019 |
| FENG JINGBINself | 11 | 2012–2016 |
| HE ZHIAN | 7 | 2012–2016 |
| GHONGADI SHANTINATH | 4 | 2012–2016 |
| LAM RES CORP | 4 | 2017–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Lake Oswego, OR, US | 24 | 2004–2020 |
| Tigard, OR, US | 2 | 2000–2001 |