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Inventor

Yoshitaka Dozen

Inventor
Tochigi, JP

Overview

46→
Patents
2008–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 46 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary
H10DInorganic electric semiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H10KOrganic electric solid-state devices9%
H01LSemiconductor devices7%
H01QAntennas, i.e. radio aerials3%
H10BElectronic memory devices3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
D21HPulp compositions2%
G06KGraphical data reading2%
PatentTitleYear
10,573,667Display device202010,032,671Manufacturing method of semiconductor device using peeling20189,941,115Method for manufacturing semiconductor device20189,716,208'Light-emitting device and manufacturing method thereof'20179,437,620'Semiconductor device and manufacturing method thereof'20169,209,355'Light-emitting device'20159,059,098'Semiconductor device and manufacturing method thereof'20159,040,420'Manufacturing method of semiconductor device including peeling layers from substrates by etching'20158,928,131'Semiconductor device and manufacturing method thereof'20158,790,994'Wireless chip and manufacturing method thereof'20148,648,439'Semiconductor device and manufacturing method of semiconductor device'20148,558,370'Semiconductor device with antenna'20138,557,699'Semiconductor device and manufacturing method thereof'20138,552,418'Semiconductor device and manufacturing method thereof'20138,530,335'Method for manufacturing semiconductor device'20138,508,027'Semiconductor device and manufacturing method thereof'20138,432,018'Semiconductor device and manufacturing method of semiconductor device'20138,362,485'Integrated circuit device and method for manufacturing integrated circuit device'20138,338,931'Semiconductor device and product tracing system utilizing the semiconductor device having top and bottom fibrous sealing layers'20128,288,773'Wireless chip and manufacturing method thereof'20128,278,663'Paper including semiconductor device and manufacturing method thereof'20128,236,629'Method for manufacturing thin film integrated circuit, and element substrate'20128,120,034'Integrated circuit device and method for manufacturing integrated circuit device'20128,088,654'Semiconductor device and manufacturing method thereof'20128,058,152'Method for manufacturing integrated circuit'20118,039,353'Semiconductor device and manufacturing method of semiconductor device'20117,989,317'Manufacturing method of semiconductor device'20117,968,427'Manufacturing method of semiconductor device'20117,939,385'Method for manufacturing thin film integrated circuit, and element substrate'20117,927,971'Method for manufacturing semiconductor device'20117,879,654'Paper including semiconductor device and manufacturing method thereof'20117,863,188'Semiconductor device and manufacturing method thereof'20117,851,886'Semiconductor device and manufacturing method of semiconductor device'20107,820,526'Manufacturing method of semiconductor device'20107,820,529'Method for manufacturing integrated circuit'20107,816,685'Integrated circuit device and method for manufacturing integrated circuit device'20107,808,098'Semiconductor device and manufacturing method thereof'20107,785,933'Method for manufacturing semiconductor device'20107,772,675'Semiconductor device and manufacturing method of semiconductor device'20107,736,958'Method for manufacturing semiconductor device'20107,713,800'Semiconductor device and manufacturing method thereof'20107,667,310'Paper including semiconductor device and manufacturing method thereof'20107,605,056'Method of manufacturing a semiconductor device including separation by physical force'20097,534,702'Method for manufacturing a semiconductor device'20097,485,511'Integrated circuit device and method for manufacturing integrated circuit device'20097,452,786'Method for manufacturing thin film integrated circuit, and element substrate'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2020Patents assigned to SEMICONDUCTOR ENERGY LAB (45)· patent assignee history
2008–2016Based in Isehara, JP· patent location history
2009–2018Based in Kanagawa, JP· patent location history
2010–2018Based in Tochigi, JP· patent location history
2011–2015Patents assigned to DOZEN YOSHITAKA (17)· patent assignee history
2011–2013Patents assigned to TSURUME TAKUYA (7)· patent assignee history
2012–2015Patents assigned to SUGIYAMA EIJI (11)· patent assignee history
2012–2013Patents assigned to TAKAHASHI HIDEKAZU (5)· patent assignee history
2015–2020Based in Atsugi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SEMICONDUCTOR ENERGY LAB452008–2020
DOZEN YOSHITAKAself172011–2015
SUGIYAMA EIJI112012–2015
TSURUME TAKUYA72011–2013
TAKAHASHI HIDEKAZU52012–2013
Locations
LocationPatentsSpan
Tochigi, JP242010–2018
Isehara, JP162008–2016
Kanagawa, JP42009–2018
Atsugi, JP22015–2020