Inventor
Mitsuhiro Kondo
Inventor
Ogaki, JP
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H05KPrinted circuits21%
Y10TTechnical subjects covered by former us classification20%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
B23PMetal-working not otherwise provided for4%
G01RMeasuring electric variables4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
B23KSoldering or unsoldering2%
C01BNon-metallic elements2%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy2%
PatentTitleYear
11,127,952Core-shell structure and production method therefof, composition for negative electrode using the core-shell structure as negative electrode active material, negative electrode and secondary battery202111,127,947Silicon nanoparticle-containing hydrogen polysilsesquioxane calcined product, negative electrode active material for lithium ion battery, negative electrode for lithium ion battery and lithium ion battery20219,702,905'Probe unit'20178,633,724'Probe-unit base member and probe unit'20148,096,840'Conductive contact holder and conductive contact unit'20127,765,692'Method of manufacturing printed wiring board'20107,612,295'Printed wiring board and method for manufacturing the same'20097,594,320'Method of manufacturing printed wiring board'20097,552,531'Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit'20097,339,118'Printed wiring board and method for manufacturing the same'20086,986,917'Printed wiring board and method of manufacturing the same'20066,825,421'Printed wiring board and method for manufacturing the same'20046,809,415'Printed-circuit board and method of manufacture thereof'20046,590,165'Printed wiring board having throughole and annular lands'20036,555,208'Printed wiring board and method of manufacturing the same'20036,455,783'Multilayer printed wiring board and method for manufacturing the same'20026,284,353'Printed wiring board and method of manufacturing the same'20016,275,743'Parts supply system'20016,228,466'Printed wiring board and method for manufacturing the same'20015,938,252'Door member locking/unlocking apparatus'19995,930,144'Parts supply system'19995,692,867'Parts supply system'19975,530,204'Electronic-parts mounting board and electronic-parts mounting board frame'19965,438,478'Electronic component carriers and method of producing the same as well as electronic devices'19955,299,097'Electronic part mounting board and semiconductor device using the same'19945,285,104'Encapsulated semiconductor device with bridge sealed lead frame'19945,274,197'Electronic-parts mounting board and electronic-parts mounting board frame'19935,252,784'Electronic-parts mounting board and electronic-parts mounting board frame'19935,206,188'Method of manufacturing a high lead count circuit board'19935,151,771'High lead count circuit board for connecting electronic components to an external circuit'19925,088,008'Circuit board for mounting electronic components'19925,022,960'Method of manufacturing circuit board for mounting electronic components'19914,908,933'Method of manufacturing a substrate for mounting electronic components'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2010Patents assigned to IBIDEN CO LTD (23)· patent assignee history
1990–1994Based in Oogaki, JP· patent location history
1993–2010Based in Ogaki, JP· patent location history
1997–2001Patents assigned to RICOH KK (3)· patent assignee history
1997–2001Based in Isehara, JP· patent location history
2012–2017Patents assigned to KONDO MITSUHIRO (3)· patent assignee history
2012–2017Patents assigned to NHK SPRING CO LTD (3)· patent assignee history
2012–2014Patents assigned to HIRONAKA KOHEI (2)· patent assignee history
2012–2017Based in Nagano, JP· patent location history
2021Based in Chiba, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBIDEN CO LTD | 23 | 1990–2010 |
| KONDO MITSUHIROself | 3 | 2012–2017 |
| NHK SPRING CO LTD | 3 | 2012–2017 |
| RICOH KK | 3 | 1997–2001 |
| HIRONAKA KOHEI | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ogaki, JP | 15 | 1993–2010 |
| Oogaki, JP | 7 | 1990–1994 |
| Nagano, JP | 3 | 2012–2017 |
| Isehara, JP | 3 | 1997–2001 |
| Chiba, JP | 2 | 2021 |