Inventor

Michimasa Takahashi

Inventor

Ogaki, JP

Overview

2009–2018

Patent span

Electricity

Primary field (CPC H)

Patents· 73 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits41%

Y10TTechnical subjects covered by former us classification39%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%

H01LSemiconductor devices3%

PatentTitleYear

10,004,145Combined wiring board and method for manufacturing the same2018 9,844,151'Method for manufacturing combined wiring board'2017 9,750,136'Wiring board and method for manufacturing the same'2017 9,717,151'Flex-rigid wiring board'2017 9,635,765'Combined wiring board and method for manufacturing combined wiring board'2017 9,603,238'Combined wiring board'2017 9,538,663'Combined wiring board and method for manufacturing combined wiring board'2017 9,480,173'Flex-rigid wiring board and method for manufacturing flex-rigid wiring board'2016 9,425,137'Wiring board'2016 9,370,101'Method for plug-in board replacement and method for manufacturing multi-piece board'2016 9,277,650'Combined wiring board and method for manufacturing the same'2016 9,277,655'Combined wiring board and method for manufacturing the same'2016 9,271,405'Flex-rigid wiring board and method of manufacturing the same'2016 9,215,811'Method for manufacturing multi-piece substrate and multi-piece substrate'2015 9,084,381'Method for manufacturing flex-rigid wiring board'2015 9,066,439'Wiring board and method for manufacturing the same'2015 9,040,837'Wiring board and method for manufacturing the same'2015 9,027,238'Multilayered printed circuit board and method for manufacturing the same'2015 9,029,713'Printed wiring board and method for manufacturing the same'2015 8,973,259'Method for manufacturing a multilayered circuit board'2015 8,933,556'Wiring board'2015 8,925,194'Flex-rigid wiring board and method of manufacturing the same'2015 8,921,705'Wiring board and fabrication method therefor'2014 8,912,451'Multilayered printed circuit board and method for manufacturing the same'2014 8,908,377'Wiring board and method for manufacturing the same'2014 8,759,687'Flex-rigid wiring board and method for manufacturing the same'2014 8,737,087'Multilayer printed wiring board and manufacturing method of multilayer printed wiring board'2014 8,705,248'Multilayer printed circuit board'2014 8,692,132'Multilayered printed circuit board and method for manufacturing the same'2014 8,677,612'Method for manufacturing flex-rigid wiring board'2014 8,669,480'Wiring board and method of manufacturing wiring board'2014 8,658,904'Flex-rigid wiring board and method for manufacturing the same'2014 8,648,263'Wiring board and method of manufacturing wiring board'2014 8,621,748'Manufacturing method for a printed wiring board'2014 8,609,991'Flex-rigid wiring board and method for manufacturing the same'2013 8,569,630'Flex-rigid wiring board and method for manufacturing the same'2013 8,536,457'Multilayer wiring board and method for manufacturing the same'2013 8,522,429'Method of manufacturing wiring board'2013 8,525,038'Flex-rigid wiring board and method of manufacturing the same'2013 8,513,539'Wiring board and method of manufacturing the same'2013 8,493,747'Flex-rigid wiring board and method for manufacturing the same'2013 8,479,389'Method of manufacturing a flex-rigid wiring board'2013 8,481,424'Multilayer printed wiring board'2013 8,476,531'Flex-rigid wiring board and method of manufacturing the same'2013 8,461,459'Flex-rigid wiring board and method for manufacturing the same'2013 8,431,829'Printed wiring board and method for manufacturing the same'2013 8,404,978'Flex-rigid wiring board and method for manufacturing the same'2013 8,405,999'Flexible wiring board and method of manufacturing same'2013 8,399,775'Flex-rigid wiring board and method of manufacturing the same'2013 8,359,738'Method of manufacturing wiring board'2013 8,353,103'Manufacturing method of multilayer printed wiring board'2013 8,354,596'Multilayer wiring board and method for manufacturing the same'2013 8,320,135'Multilayer printed circuit board'2012 8,212,363'Multilayer printed wiring board'2012 8,188,371'Flex-rigid wiring board and method of manufacturing the same'2012 8,181,341'Method of forming a multilayer printed wiring board having a bulged via'2012 8,178,789'Wiring board and method of manufacturing wiring board'2012 8,177,577'Printed wiring board having a substrate with higher conductor density inserted into a recess of another substrate with lower conductor density'2012 8,168,893'Multilayer wiring board with concave portion for accomodating electronic component'2012 8,101,868'Multilayered printed circuit board and method for manufacturing the same'2012 8,071,883'Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same'2011 8,044,306'Wiring board and method of manufacturing the same'2011 8,040,685'Stacked wiring board and method of manufacturing stacked wiring board'2011 8,035,983'Wiring board and method of manufacturing wiring board'2011 7,982,135'Flex-rigid wiring board and method of manufacturing the same'2011 7,973,249'Multilayer printed wiring board'2011 7,957,154'Multilayer printed circuit board'2011 7,929,313'Method of manufacturing multilayer printed circuit board'2011 7,902,463'Printed wiring board and method of manufacturing the same'2011 7,834,273'Multilayer printed wiring board'2010 7,759,582'Multilayer printed wiring board'2010 7,718,901'Electronic parts substrate and method for manufacturing the same'2010 7,626,829'Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2018Patents assigned to IBIDEN CO LTD (72)· patent assignee history

2009–2014Based in Gifu, JP· patent location history

2010–2018Based in Ogaki, JP· patent location history

2011–2016Patents assigned to TAKAHASHI MICHIMASA (46)· patent assignee history

2011–2016Patents assigned to AOYAMA MASAKAZU (23)· patent assignee history

2012–2015Patents assigned to MIKADO YUKINOBU (12)· patent assignee history

2013–2015Patents assigned to NAGANUMA NOBUYUKI (10)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBIDEN CO LTD	72	2009–2018
TAKAHASHI MICHIMASAself	46	2011–2016
AOYAMA MASAKAZU	23	2011–2016
MIKADO YUKINOBU	12	2012–2015
NAGANUMA NOBUYUKI	10	2013–2015

Locations

Location	Patents	Span
Ogaki, JP	58	2010–2018
Gifu, JP	15	2009–2014