A flex-rigid wiring board includes a first rigid substrate, a second rigid substrate arranged at a distance from the first rigid substrate to provide a space between the first and second rigid substrates and a flexible substrate. The flexible substrate includes a first tip portion connected to the first rigid substrate, and a second tip portion connected to the second rigid substrate such that the first and second rigid substrates are connected to each other by way of the flexible substrate. At least one bending portion is formed between the first and second tip portions of the flexible substrate, each of the at least one bending portions is provided in the space between the first and second rigid substrates.

Claims

20 · 2 independent · depth 5

20 granted claims

›1.independentA flex-rigid wiring board, comprising:na first rigid substrate having a side edge surface which extends between opposing planar surfaces of the first …+9

›2.↳ 1The flex-rigid wiring board according to claim 1, wherein:nthe first rigid substrate comprises a first rigid base material having opposing surfaces, a…d2+1

›4.↳ 1The flex-rigid wiring board according to claim 1, wherein the multiple bending portions form a folded section wherein planar surfaces of the flexible …d2+4

›9.↳ 1The flex-rigid wiring board according to claim 1, wherein the planar flexible substrate has at least one cut, and by folding and folding back at the b…d2

›10.↳ 1The flex-rigid wiring board according to claim 1, wherein the planar flexible substrate has a shield layer for shielding electromagnetic waves on its …d2

›11.independentA method for manufacturing a flex-rigid wiring board having a plurality of rigid substrates and a flexible substrate connecting at least two of the pl…+9

›12.↳ 11The method for manufacturing a flex-rigid wiring board according to claim 11, further comprisingnarranging opposing tips of the planar flexible substr…d2+2

›15.↳ 11The method for manufacturing a flex-rigid wiring board according to claim 11 wherein forming the tortuous path comprises folding and folding back the …d2+3

›19.↳ 11The method for manufacturing a flex-rigid wiring board according to claim 11, further comprising:nproviding at least one cut in the flexible substrate…d2

›20.↳ 11The method for manufacturing a flex-rigid wiring board according to claim 11, further comprising providing an electromagnetic shield layer on each of …d2

Classifications

2 codes

IPC · International Patent Classification

Section H — Electricity

H05K1/00

USPC · US Patent Classification

174/254

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Pendency

3.2 y

1,174 days filing → grant

Office actions

non-final + final

Responses

2 RCE

Examiner

Khiem Nguyen

art unit 2839 · TC 2800

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Citations: 11 back · 0 forward

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Priority chain

2 priority documents

Priority

26 Mar 2008

earliest claimed

›Priority documents — 2

Type	Document	Date
provisional	US 61039614	26 Mar 2008
related publication	US 20090242241 A1	1 Oct 2009

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