Inventor
Gottfried Beer
Inventor
Nittendorf, DE
Overview
Patents· 88 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H01LSemiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H10DInorganic electric semiconductor devices4%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%
H01QAntennas, i.e. radio aerials3%
G02BOptical elements, systems or apparatus2%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
G01RMeasuring electric variables2%
H05KPrinted circuits2%
PatentTitleYear
10,957,671Method for fabricating a semiconductor and semiconductor package202110,651,898Vertical ferrite antenna including pre-fabricated connection members202010,643,971Method for fabricating a semiconductor and semiconductor package202010,522,433Laminate package of chip on carrier and in cavity201910,438,926Method for fabricating a semiconductor and semiconductor package201910,295,570Current sensor device having a sense resistor in a re-distribution layer201910,241,088Photo-acoustic gas sensor module having light emitter and detector units201910,211,158Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module201910,102,967Method of manufacturing an inductor core for a chip assembly and chip assembly201810,090,251Semiconductor chip having a dense arrangement of contact terminals201810,008,470Embedded chip packages and methods for manufacturing an embedded chip package20189,984,928Method for producing a number of chip assemblies and method for producing a semiconductor arrangement20189,978,720Insulated die20189,859,251'Semiconductor device having a chip under package'20189,818,730'Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement'20179,721,920'Embedded chip packages and methods for manufacturing an embedded chip package'20179,711,462'Package arrangement including external block comprising semiconductor material and electrically conductive plastic material'20179,620,459'Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement'20179,620,457'Semiconductor device packaging'20179,589,859'Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement'20179,559,065'Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement'20179,553,208'Current sensor device'20179,496,237'Semiconductor device having solderable and bondable electrical contact pads'20169,390,973'On-chip RF shields with backside redistribution lines'20169,384,437'Smart card module, smart card body, smart card and smart card production method'20169,337,155'Semiconductor component with moisture barrier for sealing semiconductor body'20169,331,059'Chip, chip package and die'20169,287,206'Method of fabricating a semiconductor device with encapsulant'20169,196,510'Semiconductor package comprising two semiconductor modules and laterally extending connectors'20159,147,585'Method for fabricating a plurality of semiconductor devices'20159,129,959'Method for manufacturing an electronic module and an electronic module'20159,082,644'Method of manufacturing and testing a chip package'20159,064,869'Semiconductor module and a method for fabrication thereof by extended embedding technologies'20159,041,505'System and method for a coreless transformer'20158,990,744'Electrical measurement based circuit wiring layout modification method and system'20158,952,521'Semiconductor packages with integrated antenna and method of forming thereof'20158,912,638'Semiconductor device with hollow structure'20148,889,548'On-chip RF shields with backside redistribution lines'20148,890,284'Semiconductor device'20148,872,315'Electronic device and method of fabricating an electronic device'20148,866,292'Semiconductor packages with integrated antenna and methods of forming thereof'20148,786,085'Semiconductor structure and method for making same'20148,779,583'Semiconductor device and manufacturing method'20148,759,207'Semiconductor structure and method for making same'20148,728,869'Method for fabricating a semiconductor device and semiconductor package'20148,658,468'Method for fabricating a semiconductor and semiconductor package'20148,598,709'Method and system for routing electrical connections of semiconductor chips'20138,552,828'System and method for a coreless transformer'20138,492,200'Method for fabricating a semiconductor and semiconductor package'20138,431,063'Heat treatment for a panel and apparatus for carrying out the heat treatment method'20138,415,803'Method and system for routing electrical connections of semiconductor chips'20138,338,936'Semiconductor device and manufacturing method'20128,334,202'Device fabricated using an electroplating process'20128,330,274'Semiconductor structure and method for making same'20128,318,540'Method of manufacturing a semiconductor structure'20128,258,624'Method for fabricating a semiconductor and semiconductor package'20128,237,259'Embedded chip package'20128,216,881'Method for fabricating a semiconductor and semiconductor package'20128,212,344'Microelectromechanical semiconductor component with cavity structure and method for producing the same'20128,169,059'On-chip RF shields with through substrate conductors'20128,148,257'Semiconductor structure and method for making same'20128,119,452'Method of fabricating a semiconductor device'20128,076,784'Stacked semiconductor chips'20118,072,071'Semiconductor device including conductive element'20117,952,185'Semiconductor device with hollow structure'20117,936,052'On-chip RF shields with backside redistribution lines'20117,922,093'Semiconductor chips for TAG applications, devices for mounting the same, and mounting method'20117,915,082'Semiconductor device'20117,910,404'Method of manufacturing a stacked die module'20117,867,878'Stacked semiconductor chips'20117,863,728'Semiconductor module including components in plastic casing'20117,858,440'Stacked semiconductor chips'20107,830,026'Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip'20107,807,506'Microelectromechanical semiconductor component with cavity structure and method for producing the same'20107,759,805'Semiconductor device encapsulated by an electrically conductive plastic housing composition with conductive particles'20107,729,569'Optical transmitter and/or receiver assembly comprising a planar optical circuit'20107,692,588'Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof'20107,625,781'Semiconductor device having a plastic housing and external connections and method for producing the same'20097,585,701'Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film'20097,504,711'Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof'20097,413,353'Device and method for data transmission between structural units connected by an articulated joint'20087,268,423'Flexible rewiring plate for semiconductor components, and process for producing it'20077,101,092'Module having a circuit carrier and an electro-optical transducer and method for producing the same'20067,073,957'Optoelectronic transmitting and/or receiving module, circuit carrier, module housing, and optical plug'20067,048,450'Optoelectronic module with transmitter chip and connecting piece for the module with respect to an optical fiber and with respect to a circuit board, and methods for producing the same'20066,841,857'Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip'20056,313,729'Semiconductor device'20016,058,020'Component housing for surface mounting of a semiconductor component'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2021Based in Nittendorf, DE· patent location history
2005–2020Patents assigned to INFINEON TECHNOLOGIES AG (74)· patent assignee history
2011–2016Patents assigned to BEER GOTTFRIED (25)· patent assignee history
2011–2014Patents assigned to POHL JENS (6)· patent assignee history
2012–2016Patents assigned to ESCHER-POEPPEL IRMGARD (7)· patent assignee history
2012–2014Patents assigned to INTEL MOBILE COMM GMBH (6)· patent assignee history
2015Based in Regensburg, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 74 | 2005–2020 |
| BEER GOTTFRIEDself | 25 | 2011–2016 |
| ESCHER-POEPPEL IRMGARD | 7 | 2012–2016 |
| INTEL MOBILE COMM GMBH | 6 | 2012–2014 |
| POHL JENS | 6 | 2011–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nittendorf, DE | 87 | 2000–2021 |
| Regensburg, DE | 1 | 2015 |