Semiconductor wafer processing apparatus

FIG. 1 is a perspective view depicting the overall shape of the semiconductor wafer processing apparatus, showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken line showings of portions of the semiconductor wafer processing apparatus and portions of the semiconductor wafer processing tool illustrate environmental structure, and the broken lines form no part of the claimed design.

The shape of the semiconductor wafer processing apparatus is the feature of the design creation content.