Array of triangular semiconductor dies

FIG 1 is a first embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 2 is a front perspective view thereof;

FIG. 3 is a rear perspective view thereof;

FIG. 4 is a second embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 5 is a front perspective view thereof;

FIG. 6 is a rear perspective view thereof;

FIG. 7 is a third embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 8 is a front perspective view thereof;

FIG. 9 is a rear perspective view thereof;

FIG. 10 is a fourth embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 11 is a front perspective view thereof;

FIG. 12 is a rear perspective view thereof;

FIG. 13 is a fifth embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 14 is a front perspective view thereof; and,

FIG. 15 is a rear perspective view thereof.

The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design. The separations between the top and bottom layers of the triangle and the brackets around the space indicate that no particular length is claimed.