Triangular semiconductor die

FIG. 1 is a perspective view of a triangular semiconductor die showing our new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a side elevation view thereof;

FIG. 6 is another side elevation view thereof;

FIG. 7 is another side elevation view thereof; and,

FIG. 8 is another side elevation view thereof.

The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design.