Array of triangular semiconductor dice

FIG. 1 is a top plan view of an array of triangular semiconductor dice showing our new design;

FIG. 2 is a front perspective view thereof;

FIG. 3 is a rear perspective view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a side elevational view thereof; and,

FIG. 7 is an opposite side elevational view thereof.

The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design. For ease of illustration, separations and brackets in the figures indicate that the precise thickness of the semiconductor die is not claimed.