Elastic membrane for semiconductor wafer polishing
Granted 19 May 2015 · no office action yet
Assignee: Ebara Corporation
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Hozumi Yasuda, Katsuhide Watanabe, Osamu Nabeya, Keisuke Namiki +1 · Examiner: Selina Sikder · AU 2912 · TC 2900
Life of the patent
4 dated eventsDescription
1 parts›FIG. 1 is a front view of an…
FIG. 1 is a front view of an elastic membrane for semiconductor wafer polishing showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a plan view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a cross-section view taken along the line 7 - 7 of FIG. 2 thereof;
FIG. 8 is a enlarged view of part 8 of FIG. 7 thereof; and,
FIG. 9 is a enlarged perspective view, observed from above thereof.
The broken lines depict environmental subject matter only and form no part of the claimed design.
Claims
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