USPatentGranted
S1

Pattern formed on the ground layer of a multilayer printed circuit board

Granted 5 Aug 2008 · 2 office actions

Application
29/245,352
filed 22 Dec 2005
Publication
Not published
not published
Patent· this page
US D574339
granted 5 Aug 2008

Life of the patent

2 dated events
⤢ drag to zoomJan 2006Apr 2006Jul 2006Oct 2006Jan 2007Apr 2007Jul 2007Oct 2007Jan 2008Apr 2008Jul 2008Oct 2008Prosecution
Prosecutionhover for detail · click to open

Description

1 parts
›FIG. 1 shows a front view of the…

FIG. 1 shows a front view of the design according to a first embodiment of the present invention.

FIG. 2 shows a back view of the design according to a first embodiment of the present invention.

FIG. 3 shows a top plan view of the design according to a first embodiment of the present invention.

FIG. 4 shows a bottom plan view of the design according to a first embodiment of the present invention.

FIG. 5 shows a left side view of the design according to a first embodiment of the present invention.

FIG. 6 shows a right side view of the design according to a first embodiment of the present invention.

FIG. 7 shows a partial view of FIG. 1 corresponding to the area indicated by the dashed box in FIG. 1 .

FIG. 8 shows a detailed view of an enlarged portion of FIG. 7 indicated by the dashed box in FIG. 7 .

FIG. 9 shows a sectional view along the line 9 — 9 indicated in FIG. 7 .

FIG. 10 shows a front plan view of the design according to a second embodiment of the present invention. In this embodiment, the ground layer is transparent.

FIG. 11 shows a back view of the design according to a second embodiment of the present invention.

FIG. 12 shows a top plan view of the design according to a second embodiment of the present invention.

FIG. 13 shows a bottom plan view of the design according to a second embodiment of the present invention.

FIG. 14 shows a right side view of the design according to a second embodiment of the present invention.

FIG. 15 shows a left side view of the design according to a second embodiment of the present invention.

FIG. 16 shows a partial view of FIG. 11 corresponding to the area indicated by the dashed box in FIG. 11 .

FIG. 17 shows a detailed view of an enlarged portion of FIG. 17 indicated by the dashed box in FIG. 17 ; and,

FIG. 18 shows a sectional view along the line 19 — 19 indicated in FIG. 17 .

The broken lines represent unclaimed subject matter.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D13/182

Claim changes

Soon
Coming soonHow the claims changed between publication and grant

See which claims were amended, added or cancelled during examination, with every added and removed word marked.

AmendedAddedCancelledUnchanged

The published claims of this patent are not paired with the granted ones in what we hold.

File wrapper

Pendency
2.6 y
957 days filing → grant
Office actions
1
non-final + final
Responses
1
no RCE
Examiner
Selina Sikder
art unit 2912 · TC 2900
Citations: 12 back · 0 forward

See the full prosecution history — every USPTO and applicant action on this file, in order.

Log in to unlock

Chain of title

⤢ drag to zoom20062008201020122014201620182020202220242026Owner 1
Titlehover for detail · click to open

See the full assignment history — every owner this patent has passed through, with recordation dates and reel/frame numbers.

Log in to unlock

Term & fees

See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.

Log in to unlock

Validity challenges

See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.

Log in to unlock

Citations

See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.

Log in to unlock