USPatentGranted
S1

IC module insert

Granted 22 May 2001 · no office action yet

Assignee: Advantest Corporation

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Attorney: Attorney · Log in to unlock

Inventors: Toshiyuki Kiyokawa, Yoshiyuki Masuo, Hiroyuki Takahashi · Examiner: Brian N. Vinson · AU 2911 · TC 2900

Application
120362
filed 20 Mar 2000
Publication
Not published
not published
Patent· this page
US D442568
granted 22 May 2001

Life of the patent

4 dated events
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Description

1 parts
›FIG. 1 is a perspective view of an…

FIG. 1 is a perspective view of an IC module insert according to a first embodiment of the present design.

FIG. 2 is a front view of the IC module insert shown in FIG. 1.

FIG. 3 is a rear view of the IC module insert shown in FIG. 1.

FIG. 4 is a left side view of the IC module insert shown in FIG. 1.

FIG. 5 is a right side view of the IC module insert shown in FIG. 1.

FIG. 6 is a top plan view of the IC module insert shown in FIG. 1.

FIG. 7 is a bottom plan view of the IC module insert shown in FIG. 1.

FIG. 8 is a sectional view along line VIII—VIII of FIG. 2.

FIG. 9 is a sectional view along line IX—IX of FIG. 6.

FIG. 10 is a perspective view of an IC module insert according to a second embodiment of the present design.

FIG. 11 is a front view of the IC module insert shown in FIG. 10.

FIG. 12 is a rear view of the IC module insert shown in FIG. 10.

FIG. 13 is a left side view of the IC module insert shown in FIG. 10.

FIG. 14 is a right side view of the IC module insert shown in FIG. 10.

FIG. 15 is a top plan view of the IC module insert shownn in FIG. 10.

FIG. 16 is a bottom plan view of the IC module insert shown in FIG. 10.

FIG. 17 is a sectional view along line XVII—XVII of FIG. 11.

FIG. 18 is a sectional view along line XVIII—XVIII of FIG. 15; and,

FIG. 19 is a reduced perspective view of the embodiment of FIG. 1, with the broken-line disclosure of a second module insert and the larger rack assembly being for illustrative purposes only and forming no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

2 codes
USPC · US Patent Classification
D13/199D13/182

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File wrapper

Pendency
1.2 y
428 days filing → grant
Office actions
0
on the grant's record
Examiner
Brian N. Vinson
art unit 2911 · TC 2900
Citations: 3 back · 0 forward

Chain of title

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Citations

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