USPatentGranted

Deposition ring of a process kit for semiconductor substrate processing

Granted 28 Jan 2025 · no office action yet

Current assignee: Applied Materials Israel · originally Applied Materials, Inc.

Inventors: Arun Chakravarthy Chakravarthy, Abhishek Chowdhury, Edwin C. Suarez, Diego Ramiro Puente Sotomayor +4 · Examiner: Brett Miller · AU 2925 · TC 2900

Application

29/848,747

filed 4 Aug 2022

Publication

Not published

not published

Patent· this page

US D1059312

granted 28 Jan 2025

term adjustment not held

none

Litigation

checked

Classifications

Citations

27 cites · 4 cited by

Life of the patent

5 dated events

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Description

1 parts

›FIG. 1 is a top isometric view of…

FIG. 1 is a top isometric view of a deposition ring of a process kit for semiconductor substrate processing, according to the novel design.

FIG. 2 is a bottom isometric view thereof.

FIG. 3 is a top plan view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a left elevation view thereof, enlarged to more clearly show details.

FIG. 6 is a right elevation view thereof, enlarged to more clearly show details.

FIG. 7 is a back elevation view thereof, enlarged to more clearly show details; and,

FIG. 8 is a front elevation view thereof, enlarged to more clearly show details.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1

1 granted claims

›1.independentThe ornamental design for a deposition ring of a process kit for semiconductor substrate processing, as shown and described.

Classifications

1 codes

USPC · US Patent Classification

D13/182

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Pendency

2.5 y

908 days filing → grant

Office actions

none on record

Responses

no RCE

Examiner

Brett Miller

art unit 2925 · TC 2900

Law firm

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Citations: 27 back · 4 forward

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Worldwide family

3 members · 3 offices

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Members

DOCDB simple family 86900333

Offices

US · JP

Granted

2 of 3

grant date present

Non-English titles

shown as filed, never translated

›IP5 & PCT — 2 members

Office	Publication	Kind	Published	Filed	Status	Title
USthis patent	US-D1059312-S	S1	28 Jan 2025	4 Aug 2022	granted	Deposition ring of a process kit for semiconductor substrate processing
JP	JP-1747664-S	S	29 Jun 2023	6 Feb 2023	granted	半導体基板処理のための処理キットの堆積リングja

›Other offices — 1 members

Office	Publication	Kind	Published	Filed	Status	Title
TW	TW-D228654-S	S	21 Nov 2023	1 Feb 2023	published	用於半導體基板處理的處理套件的沉積環zh

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Citations

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