Cover ring for use in semiconductor processing chamber
Granted 6 Aug 2024 · 2 office actions
Current assignee: Applied Materials Israel · originally Applied Materials, Inc.
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Inventors: Harisha Sathyanarayana, Siqing Lu, Edwin C. Suarez, Nataraj Bhaskar Rao +1 · Examiner: Shawn T Gingrich · AU 2932 · TC 2900
Life of the patent
8 dated eventsDescription
1 parts›FIG. 1 is a bottom isometric view of…
FIG. 1 is a bottom isometric view of a cover ring for use in a semiconductor processing chamber in accordance with some embodiments.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a front elevation view thereof.
FIG. 5 is a back elevation view thereof.
FIG. 6 is a right side elevation view thereof; and,
FIG. 7 is a left side elevation view thereof.
The broken lines in the drawings illustrate portions of the cover ring for use in a semiconductor processing chamber that form no part of the claimed design.
Claims
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5 members · 3 offices›IP5 & PCT — 3 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| USthis patent | US-D1038049-S | S1 | 6 Aug 2024 | 18 Nov 2020 | granted | Cover ring for use in semiconductor processing chamber |
| JP | JP-1707743-S | S | 17 Feb 2022 | 12 May 2021 | granted | 半導体処理チャンバ用カバーリングja |
| JP | JP-1707822-S | S | 17 Feb 2022 | 12 May 2021 | granted | 半導体処理チャンバ用カバーリングja |
›Other offices — 2 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| TW | TW-D218919-S | S | 21 May 2022 | 5 May 2021 | published | Cover ring for use in semiconductor processing chamber |
| TW | TW-D222669-S | S | 21 Dec 2022 | 5 May 2021 | published | 用於半導體處理腔室中的蓋環zh |
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