Liquid discharge nozzle for semiconductor substrate processing apparatus
Granted 14 Sep 2021 · 2 office actions
Assignee: Tokyo Electron Limited
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Yoshifumi Amano, Kazuhiro Aiura · Examiner: Jack Reickel · AU 2925 · TC 2900
Life of the patent
2 dated eventsDescription
1 parts›FIG. 1 is a front, top perspective view…
FIG. 1 is a front, top perspective view of a liquid discharge nozzle for semiconductor substrate processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a right-side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Claims
1 · 1 independent · depth 1Classifications
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3 members · 3 offices›IP5 & PCT — 2 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| USthis patent | US-D930796-S | S1 | 14 Sep 2021 | 3 Aug 2020 | granted | Liquid discharge nozzle for semiconductor substrate processing apparatus |
| JP | JP-1683121-S | S | 12 Apr 2021 | 8 Jun 2020 | granted | 液体吐出用ノズルja |
›Other offices — 1 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| TW | TW-D215672-S | S | 1 Dec 2021 | 4 Aug 2020 | published | 液體噴吐用噴嘴zh |
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