USPatentGranted
S1

Pressing member for substrate polishing apparatus

Granted 11 Jun 2019 · no office action yet

Assignee: Ebara Corporation

Law firm: Law firm · Log in to unlock

Attorney: Attorney · Log in to unlock

Inventors: Kenji Kodera, Masayuki Nakanishi, Kenji Kamimura, Satoru Yamamoto +1 · Examiner: Patricia A Palasik · AU 2918 · TC 2900

Application
29/659,963
filed 14 Aug 2018
Publication
Not published
not published
Patent· this page
US D851140
granted 11 Jun 2019

Life of the patent

4 dated events
⤢ drag to zoom20182020202220242026202820302032203420362038ProsecutionTerm & fees
ProsecutionTerm & feeshover for detail · click to open

Description

1 parts
›FIG. 1 is a first perspective view, observed…

FIG. 1 is a first perspective view, observed from a front of a pressing member for a substrate polishing apparatus showing our new design;

FIG. 2 is a second perspective view, observed from a rear thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof; and,

FIG. 7 is a right-side view thereof, a left-side view being a mirror image thereof.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D15/126

Claim changes

Soon
Coming soonHow the claims changed between publication and grant

See which claims were amended, added or cancelled during examination, with every added and removed word marked.

AmendedAddedCancelledUnchanged

The published claims of this patent are not paired with the granted ones in what we hold.

File wrapper

⤢ drag to zoomJul 2018Oct 2018Jan 2019Apr 2019Jul 2019USPTOApplicantNotice of allowance
USPTOApplicanthover for detail · click to open
Pendency
0.8 y
301 days filing → grant
Office actions
0
none on record
Examiner
Patricia A Palasik
art unit 2918 · TC 2900
Citations: 32 back · 0 forward

See the full prosecution history — every USPTO and applicant action on this file, in order.

Log in to unlock

Term & fees

See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.

Log in to unlock

Validity challenges

See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.

Log in to unlock

Citations

See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.

Log in to unlock