USPatentGranted
S1

Insulation unit cover of semiconductor manufacturing apparatus

Granted 29 May 2018 · no office action yet

Current assignee: Kokusai Electric Co. Ltd. · originally Hitachi, Ltd.

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Inventors: Takatomo Yamaguchi · Examiner: Thomas Johannes · AU 2921 · TC 2900

Application
29/572,569
filed 28 Jul 2016
Publication
Not published
not published
Patent· this page
US D818961
granted 29 May 2018

Life of the patent

6 dated events
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Description

1 parts
›FIG. 1 is a perspective view of an…

FIG. 1 is a perspective view of an insulation unit cover of semiconductor manufacturing apparatus showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross-sectional view thereof taken in the direction of line 8 - 8 in FIG. 6 .

The dot-dash broken lines FIG. 6 are for reference purposes only; the broken lines form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D13/129

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File wrapper

⤢ drag to zoomJul 2016Oct 2016Jan 2017Apr 2017Jul 2017Oct 2017Jan 2018Apr 2018Jul 2018USPTOApplicantNotice of allowance
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Pendency
1.8 y
670 days filing → grant
Office actions
0
none on record
Examiner
Thomas Johannes
art unit 2921 · TC 2900
Citations: 13 back · 0 forward

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Chain of title

⤢ drag to zoom20162018202020222024202620282030203220342036Owner 1Owner 2
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Term & fees

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Worldwide family

3 members · 3 offices
US1JP1TW1
this patentIP5 & PCTother officessolid = grantedhover for detail · click to open
Members
3
DOCDB simple family 57482774
Offices
3
US · JP
Granted
2 of 3
grant date present
Non-English titles
1
shown as filed, never translated
›IP5 & PCT — 2 members
OfficePublicationKindPublishedFiledStatusTitle
USthis patentUS-D818961-SS129 May 201828 Jul 2016grantedInsulation unit cover of semiconductor manufacturing apparatus
JPJP-1565116-SS12 Dec 201610 Feb 2016grantedno title held
›Other offices — 1 members
OfficePublicationKindPublishedFiledStatusTitle
TWTW-D183005-SS11 May 201728 Jul 2016published半導體製造裝置之隔熱組件外罩zh

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Citations

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