Insulation unit cover of semiconductor manufacturing apparatus
Granted 29 May 2018 · no office action yet
Current assignee: Kokusai Electric Co. Ltd. · originally Hitachi, Ltd.
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Takatomo Yamaguchi · Examiner: Thomas Johannes · AU 2921 · TC 2900
Life of the patent
6 dated eventsDescription
1 parts›FIG. 1 is a perspective view of an…
FIG. 1 is a perspective view of an insulation unit cover of semiconductor manufacturing apparatus showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view thereof taken in the direction of line 8 - 8 in FIG. 6 .
The dot-dash broken lines FIG. 6 are for reference purposes only; the broken lines form no part of the claimed design.
Claims
1 · 1 independent · depth 1Classifications
1 codesClaim changes
SoonSee which claims were amended, added or cancelled during examination, with every added and removed word marked.
The published claims of this patent are not paired with the granted ones in what we hold.
File wrapper
See the full prosecution history — every USPTO and applicant action on this file, in order.
Log in to unlockChain of title
See the full assignment history — every owner this patent has passed through, with recordation dates and reel/frame numbers.
Log in to unlockTerm & fees
See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.
Log in to unlockWorldwide family
3 members · 3 offices›IP5 & PCT — 2 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| USthis patent | US-D818961-S | S1 | 29 May 2018 | 28 Jul 2016 | granted | Insulation unit cover of semiconductor manufacturing apparatus |
| JP | JP-1565116-S | S | 12 Dec 2016 | 10 Feb 2016 | granted | no title held |
›Other offices — 1 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| TW | TW-D183005-S | S | 11 May 2017 | 28 Jul 2016 | published | 半導體製造裝置之隔熱組件外罩zh |
Validity challenges
See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.
Log in to unlockCitations
See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.
Log in to unlock