Diamond-shaped semiconductor die

FIG. 1 is a top plan view of a first embodiment of a diamond-shaped semiconductor die showing our new design;

FIG. 2 is a front perspective view thereof;

FIG. 3 is a rear perspective view thereof;

FIG. 4 is a top plan view of a second embodiment of a diamond-shaped semiconductor die showing our new design

FIG. 5 is a front perspective view thereof;

FIG. 6 is a rear perspective view thereof;

FIG. 7 is a top plan view of a third embodiment of a diamond-shaped semiconductor die showing our new design;

FIG. 8 is a front perspective view thereof;

FIG. 9 is a rear perspective view thereof;

FIG. 10 is a top plan view of a fourth embodiment of a diamond-shaped semiconductor die showing our new design;

FIG. 11 is a front perspective view thereof;

FIG. 12 is a rear perspective view thereof;

FIG. 13 is a top plan view of a fifth embodiment of a diamond-shaped semiconductor die showing our new design;

FIG. 14 is a front perspective view thereof;

FIG. 15 is a rear perspective view thereof;

FIG. 16 is a top plan view of a sixth embodiment of a diamond-shaped semiconductor die showing our new design;

FIG. 17 is a front perspective view thereof; and,

FIG. 18 is a rear perspective view thereof.

The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design. The diamond-shaped semiconductor die is shown broken away in FIGS. 1-18 to indicate that no particular length is claimed.