Circuit package lid
Granted 1 May 2012 · no office action yet
Assignee: Advanced Micro Devices, Inc
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Nikon Banouvong, Chia-Ken Leong, Sanjay Dandia, Stephen Heng · Examiner: Selina Sikder · AU 2912 · TC 2900
Life of the patent
2 dated eventsDescription
1 parts›FIG. 1 is a front perspective view of…
FIG. 1 is a front perspective view of the circuit package lid;
FIG. 2 is a front view of the circuit package lid;
FIG. 3 is a top view of the circuit package lid;
FIG. 4 is a bottom view of the circuit package lid;
FIG. 5 is a left side view of the circuit package lid;
FIG. 6 is a right side view of the circuit package lid; and,
FIG. 7 is a rear view of the circuit package lid.
The broken line showing of the circuit package lid is for illustrative purposes only and forms no part of the claimed design.
Claims
1 · 1 independent · depth 1Classifications
1 codesClaim changes
SoonSee which claims were amended, added or cancelled during examination, with every added and removed word marked.
The published claims of this patent are not paired with the granted ones in what we hold.
File wrapper
See the full prosecution history — every USPTO and applicant action on this file, in order.
Log in to unlockChain of title
See the full assignment history — every owner this patent has passed through, with recordation dates and reel/frame numbers.
Log in to unlockTerm & fees
See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.
Log in to unlockWorldwide family
3 members · 2 offices›IP5 & PCT — 2 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| US | US-D641720-S | S1 | 19 Jul 2011 | 26 Mar 2010 | granted | Circuit package lid |
| USthis patent | US-D658607-S | S1 | 1 May 2012 | 17 Jun 2011 | granted | Circuit package lid |
›Other offices — 1 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| TW | TW-D144531-S | S | 21 Dec 2011 | 15 Sep 2010 | published | Circuit package lid |
Validity challenges
See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.
Log in to unlockCitations
See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.
Log in to unlock