Circuit package lid
Granted 1 May 2012 · no office action yet
Assignee: Advanced Micro Devices, Inc
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Nikon Banouvong, Chia-Ken Leong, Sanjay Dandia, Stephen Heng · Examiner: Selina Sikder · AU 2912 · TC 2900
Life of the application
5 dated eventsDescription
1 parts›FIG. 1 is a front perspective view of…
FIG. 1 is a front perspective view of the circuit package lid;
FIG. 2 is a front view of the circuit package lid;
FIG. 3 is a top view of the circuit package lid;
FIG. 4 is a bottom view of the circuit package lid;
FIG. 5 is a left side view of the circuit package lid;
FIG. 6 is a right side view of the circuit package lid; and,
FIG. 7 is a rear view of the circuit package lid.
The broken line showing of the circuit package lid is for illustrative purposes only and forms no part of the claimed design.
Claims as granted
1 claimLog in to read the claims of this application.
Log in to unlockClassifications
1 codesClaim changes
SoonSee which claims were amended, added or cancelled during examination, with every added and removed word marked.
The published claims of this application are not paired with the granted ones in what we hold.
File wrapper
See the full prosecution history — every USPTO and applicant action on this file, in order.
Log in to unlockDocuments
Log in to open the documents of this file: the application as filed, every office action and response, the notice of allowance.
Log in to unlockChain of title
See the full assignment history — every owner this patent has passed through, with recordation dates and reel/frame numbers.
Log in to unlock