Circuit package lid
Granted 19 Jul 2011 · no office action yet
Assignee: Advanced Micro Devices, Inc
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Sanjay Dandia, Chia-Ken Leong, Stephen Heng, Nikon Banouvong · Examiner: Selina Sikder · AU 2912 · TC 2900
Life of the patent
2 dated eventsDescription
1 parts›FIG. 1 is a front perspective view of…
FIG. 1 is a front perspective view of a circuit package lid;
FIG. 2 is a front view of the circuit package lid;
FIG. 3 is a top view of the circuit package lid;
FIG. 4 is a bottom view of the circuit package lid;
FIG. 5 is a left side view of the circuit package lid;
FIG. 6 is a right side view of the circuit package lid; and,
FIG. 7 is a rear view of the circuit package lid.
Claims
1 · 1 independent · depth 1Classifications
1 codesClaim changes
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3 members · 2 offices›IP5 & PCT — 2 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| USthis patent | US-D641720-S | S1 | 19 Jul 2011 | 26 Mar 2010 | granted | Circuit package lid |
| US | US-D658607-S | S1 | 1 May 2012 | 17 Jun 2011 | granted | Circuit package lid |
›Other offices — 1 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| TW | TW-D144531-S | S | 21 Dec 2011 | 15 Sep 2010 | published | Circuit package lid |
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