Circuit package lid
Granted 19 Jul 2011 · no office action yet
Assignee: Advanced Micro Devices, Inc
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Attorney: Attorney · Log in to unlock
Inventors: Sanjay Dandia, Chia-Ken Leong, Stephen Heng, Nikon Banouvong · Examiner: Selina Sikder · AU 2912 · TC 2900
Life of the application
5 dated eventsDescription
1 parts›FIG. 1 is a front perspective view of…
FIG. 1 is a front perspective view of a circuit package lid;
FIG. 2 is a front view of the circuit package lid;
FIG. 3 is a top view of the circuit package lid;
FIG. 4 is a bottom view of the circuit package lid;
FIG. 5 is a left side view of the circuit package lid;
FIG. 6 is a right side view of the circuit package lid; and,
FIG. 7 is a rear view of the circuit package lid.
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