Transfer-chamber

The present article relates to a transfer-chamber of a multi-chamber type semiconductor substrate processing apparatus for a film forming process and other processes for semiconductor substrates and others to be processed. A plurality of process chambers are provided around the transfer-chamber so as to transfer the substrate received from a load-lock chamber to, through a loader-module shown in a reference drawing illustrating a state of usage of the transfer-chamber, the process chambers by means of a vacuum arm provided in the transfer-chamber.

FIG. 1 is a front elevational view of the transfer-chamber;

FIG. 2 is a back elevational view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is 7—7 sectional view shown in FIG. 3.

FIG. 8 is 8—8 sectional view shown in FIG. 3.

FIG. 9 is 9—9 sectional view shown in FIG. 5.

FIG. 10 is a perspective view thereof; and,

FIG. 11 is a reference figure showing a bottom perspective view thereof.