USPatentGranted
B2

Pattern-forming method, and radiation-sensitive resin composition

Granted 1 Sep 2015 · 4 office actions

Life of the patent

12 dated events
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Abstract

A pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed. A developer solution used in developing the exposed resist film includes no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a first polymer and a radiation-sensitive acid generator. The first polymer includes a first structural unit having an acid-labile group and an alicyclic group. The alicyclic group is capable of avoiding dissociation from a molecular chain by an action of an acid.

Claims

12 · 1 independent · depth 3
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12 granted claims

Classifications

7 codes
IPC · International Patent Classification
Section C — Chemistry; metallurgy
  • C08F220/28
  • C08F20/28
Section G — Physics
  • G03F7/32
  • G03F7/039
  • G03F7/11
  • G03F7/20
  • G03F7/004

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File wrapper

⤢ drag to zoomApr 2013Jul 2013Oct 2013Jan 2014Apr 2014Jul 2014Oct 2014Jan 2015Apr 2015Jul 2015Oct 2015USPTOApplicantRestriction requirementNon-final rejectionResponse after non-finalFinal rejectionResponse after finalNotice of allowance
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Pendency
2.4 y
881 days filing → grant
Office actions
2
after a restriction
Responses
2
1 RCE
Examiner
Daborah Chacko Davis
art unit 1722 · TC 1700
Citations: 62 back · 0 forward

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20130224661 A129 Aug 2013

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