A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion not overlapped by the first die. A first Thermal Interface Material (TIM) is over and contacting a top surface of the first die. A heat dissipating lid has a first bottom surface contacting the first TIM. A second TIM is over and contacting the second portion of the second die. A heat dissipating ring is over and contacting the second TIM.

Claims

20 · 3 independent · depth 3

20 granted claims

›1.independentA package comprising:na first die;a second die underlying the first die and in a same first die stack as the first die, wherein the second die compris…+7

›2.↳ 1The package of claim 1, wherein the second die comprises a high-power-consuming circuit and a low-power-consuming circuit consuming less power than th…d2

›3.↳ 1The package of claim 1 further comprising:na third die;a fourth die underlying the first die and in a same second die stack as the third die, wherein …d2+1

›5.↳ 1The package of claim 1 further comprising:na package substrate;a System-on-Chip (SoC) die, wherein the System-on-Chip (SoC) die and the first die stac…d2+1

›7.↳ 1The package of claim 1, wherein the heat dissipating ring and the heat dissipating lid comprise heat sinks, and wherein each of the heat sinks compris…d2

›8.↳ 1The package of claim 1 further comprising:nan adhesive overlapping and contacting an extension portion of the heat dissipating ring, wherein the adhes…d2

›9.independentA package comprising:na die stack comprising a plurality of dies;a die underlying and bonded to the die stack, wherein the die comprises:na first port…+6

›10.↳ 9The package of claim 9, wherein the heat dissipating lid and the heat dissipating ring are physically discrete components.d2

›11.↳ 9The package of claim 9 further comprising an adhesive having a thermal conductivity lower than a thermal conductivity of the second TIM, wherein the a…d2

›12.↳ 9The package of claim 9, wherein the heat dissipating ring further comprises an additional bottom surface adhered to an underlying package component th…d2

›13.↳ 9The package of claim 9, wherein top surfaces of the heat dissipating ring and the heat dissipating lid are substantially co-planar, and wherein the pa…d2

›14.↳ 9The package of claim 9, wherein the heat dissipating ring and the heat dissipating lid comprise heat sinks, and wherein each of the heat sinks compris…d2

›15.↳ 9The package of claim 9, wherein the second TIM forms a ring encircling the die stack.d2

›16.independentA package comprising:na package substrate;a die overlying and bonded to the package substrate;a die stack comprising a plurality of dies, wherein the …+4

Classifications

5 codes

IPC · International Patent Classification

Section H — Electricity

H01L23/34
H01L23/10

USPC · US Patent Classification

257/706438/106257/686

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Pendency

1.5 y

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Telly Green

art unit 2822 · TC 2800

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