Multiple die packaging interposer structure and method

A device, comprising:nat least one interposer stud;a carrier plane molded around the at least one interposer stud;a first redirection layer disposed on a first surface of the carrier plane, the redirection layer in electrical contact with at least one interposer stud;a first die mounted to at least a portion of the first redirection layer and in signal communication with at least one interposer stud;a second redirection layer on a second surface of the carrier plane opposite the first surface; andat least one first interlevel connection structure mounted to at least a portion of the first redirection layer such that at least one first interlevel connection structure is in signal communication with at least one interposer stud and extends above the first die.

A device, comprising:none or more interposer studs;a carrier plane molded around at least one of the one or more interposer studs;a first redirection layer disposed on a first surface of the carrier plane, the first redirection layer in electrical contact with at least one interposer stud;at least one first die disposed on the first redirection layer and in signal communication with at least one of the one or more interposer studs;at least one second die disposed on a second surface of the carrier plane and in signal communication with at least one of the one or more interposer studs and the at least one first die;at least one first interlevel connection structure disposed on the first redirection layer and in signal communication with the one or more interposer studs;at least one second interlevel connection structure disposed on the second surface of the carrier plane and in signal communication with the at one or more interposer studs and the at least one first die via at least one interposer stud; anda top package disposed on the at least one second interlevel connection structure, wherein the top package comprises a third integrated circuit and at least one mounting board, and wherein the third integrated circuit of the top package is in signal communication with the at least one second interlevel connection structure and at the least one first die.

An interposer package apparatus, comprising:na plurality of first interposer studs;at least one carrier plane molded around at least one of the plurality of first interposer studs;a first redirection layer structure having at least one device mounting pad and at least one board mounting pad, and disposed on a first surface of the carrier plane, where in at least one of the plurality of first interposer studs is electrically connected to the first redirection layer;a second redirection layer structure having at least one device mounting pad and at least one board mounting pad, and disposed on a second surface of the carrier plane opposite the first surface, wherein the second redirection layer is electrically connected to at least one interposer stud;at least one first integrated circuit die attached to the first redirection layer;at least one second integrated circuit die attached to the second redirection layer; andat least one second interposer stud attached to a board mounting pad of the second redirection layer, and electrically connected to at least a portion of the first redirection layer, and wherein the at least one second interposer is configured to accept the attachment of a top package and to hold the top package at a first distance from the second integrated circuit die.