Generalization of shot definitions for mask and wafer writing tools
Granted 26 Aug 2014 · 2 office actions
Current assignee: Siemens Industry, Inc. · originally Siemens AG
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Inventors: Steffen F. Schulze, Emile Y. Sahouria · Examiner: Christopher Young · AU 1721 · TC 1700
Life of the patent
12 dated eventsAbstract
Techniques for reducing the number of shots required by a radiation beam writing tool to write a pattern, such as fractured layout design, onto a substrate. One or more apertures are employed by a radiation beam writing tool to write a desired pattern onto a substrate using L-shaped images, T-shaped images, or some combination of both. By reducing the number of shots required to write a pattern onto a substrate, various implementations of the invention may reduce the write time and/or write complexity of the write process.
Claims
9 · 1 independent · depth 3Classifications
8 codes- G03F7/20
- G03F1/50
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2 priority documents›Priority documents — 2
| Type | Document | Date |
|---|---|---|
| provisional | US 61250833 | 12 Oct 2009 |
| related publication | US 20130071776 A1 | 21 Mar 2013 |
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