USPatentGranted
B2

Semiconductor device

Granted 14 Jan 2014 · 4 office actions

Assignee: Toshiba

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Attorney: Attorney · Log in to unlock

Inventors: Tetsuo Hatakeyama, Takashi Shinohe · Examiner: Yosef Gebreyesus

Life of the patent

12 dated events
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Abstract

A semiconductor device includes a semiconductor substrate made of silicon carbide and having a surface, a normal vector for the surface having an off angle with respect to a <0001> direction or a <000-1> direction, a semiconductor layer of a first conductivity type formed on the semiconductor substrate, a first semiconductor region of a second conductivity type formed in a surface region of the semiconductor layer, a source region of a first conductivity type formed in a surface region of the first semiconductor region, a second semiconductor region of a second conductivity type formed in the surface region of the semiconductor layer, contacting the first semiconductor region, and having a bottom surface lower than a bottom surface of the first semiconductor region, wherein at least one end of the bottom surface of the second semiconductor region is perpendicular to an off angle direction.

Claims

13 · 1 independent · depth 3
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13 granted claims

Classifications

5 codes
IPC · International Patent Classification
Section H — Electricity
  • H01L29/15
USPC · US Patent Classification
257/77257/322257/E31.054257/199

Claim changes

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File wrapper

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Pendency
4.8 y
1,762 days filing → grant
Office actions
2
non-final + final
Responses
2
2 RCE
Examiner
Yosef Gebreyesus
art unit —
Citations: 12 back · 0 forward

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Term & fees

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20100078650 A11 Apr 2010

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Citations

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