Vertical interconnect structure, memory device and associated production method

A method for producing a memory device comprising the steps of:nforming a multiplicity of insular active regions in a semiconductor substrate,forming two strip-type word line stacks with a gate dielectric layer and a gate layer on the semiconductor substrate in such a way that three contact regions are formed in the insular active regions,forming a common drain region in a contact region lying between the two word line stacks and forming source regions in the remaining contact regions,forming a common nanoelement on the common drain region, and forming additional nanoelements on the source regions,embedding the common nanoelement in a dielectric layer,forming a first depression in the dielectric layer in the region of the common nanoelement,filling a bit line layer into the first depression, the bit line layer being electrically connected to the contact region lying between the two word stacks,etching the bit line layer back to form a second depression,filling completely the second depression with a dielectric filling material, andforming at least one memory element at the surface of the dielectric layer in such a way that it is electrically connected to the additional nanoelements.

A method for producing a memory device comprising the steps of:nforming a multiplicity of insular active regions in a semiconductor substrate,forming two strip-type word line stacks with a gate dielectric layer and a gate layer on the semiconductor substrate in such a way that three contact regions are formed in the insular active regions,forming a common drain region in a contact region lying between the two word line stacks and forming source regions in the remaining contact regions,forming nanoelements on the source regions,forming a dielectric layer over the common drain region and the nanoelements,etching back the dielectric layer to uncover an upper region of the nanoelements;forming a dielectric etching stop layer at the surface of the dielectric layer and of the uncovered regions of the nanoelements;forming an auxiliary dielectric layer at the surface of the etching stop layer;forming a trench in the region of the common drain region in the dielectric layer, the etching stop layer and the auxiliary dielectric layer as far as the drain region, filling a bit line layer into the trench, etching the bit line layer back to form a depression, andfilling completely the depression with dielectric filling material.