Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention is that the integrated circuit products are produced a batch at a time, and that singulation of the batch into individualized integrated circuit products uses a non-linear (e.g., non-rectangular or curvilinear) sawing or cutting action so that the resulting individualized integrated circuit packages no longer need to be completely rectangular. Another aspect of the invention is that the integrated circuit products can be produced with semiconductor assembly processing such that the need to provide an external package or container becomes optional.

Claims

20 · 2 independent · depth 3

20 granted claims

›1.independentAn integrated circuit, comprising:none of a leadframe or substrate;one or more dies attached on at least one side of the leadframe or substrate;electr…+15

›2.↳ 1An integrated circuit as recited in claim 1,nwherein the integrated circuit is a memory card.d2

›3.↳ 1An integrated circuit as recited in claim 1,nwherein the integrated circuit is a removable, non-rectangular peripheral card.d2

›4.↳ 1An integrated circuit as recited in claim 1, wherein the non-linear shape is achieved through a curvilinear or non-rectangular cut during said singula…d2

›5.↳ 1An integrated circuit as recited in claim 1, further comprising an outer external package affixed about the leadframe or substrate and one or more die…d2

›6.↳ 1An integrated circuit as recited in claim 1, wherein the the leadframe or substrate and one or more dies are electrically tested before said singulati…d2

›7.↳ 1An integrated circuit as recited in claim 1, further comprising a coating applied to the leadframe or substrate and one or more dies after said singul…d2

›8.↳ 1An integrated circuit as recited in claim 1, further comprising one or more passive components attached to the leadframe or substrate.d2

›9.↳ 1An integrated circuit as recited in claim 1, further comprising a mark applied to the molding compound.d2+1

›11.↳ 1An integrated circuit as recited in claim 1, wherein the electrical connections are a wire bond between each of the one or more dies and the leadframe…d2

›12.↳ 1An integrated circuit as recited in claim 1, wherein said singulation is performed by a laser beam provided by a laser.d2

›13.↳ 1An integrated circuit as recited in claim 1, wherein said singulation is performed by a high pressure water jet.d2+1

›15.↳ 1An integrated circuit as recited in claim 1, wherein the one or more dies include at least a memory die and a controller die.d2+1

›17.independentAn integrated circuit, comprising:na printed circuit board;one or more dies attached to at least one side of the printed circuit board;electrical conn…+3

Classifications

4 codes

IPC · International Patent Classification

Section H — Electricity

H01L23/13

USPC · US Patent Classification

257/730257/E23.004361/737

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Pendency

6.0 y

2,202 days filing → grant

Office actions

non-final + final

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4 RCE

Examiner

Daniel Shook

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20060267165 A1	30 Nov 2006

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