USPatentGranted
B2

Compound semiconductor device and manufacturing method of the same

Granted 27 Mar 2012 · 2 office actions

Assignee: Fujitsu Limited

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Inventors: Atsushi Yamada, Tadahiro Imada · Examiner: Victor A Mandala · AU 2826 · TC 2800

Life of the patent

10 dated events
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Abstract

An i-GaN layer (electron transit layer), an n-GaN layer (compound semiconductor layer) formed over the i-GaN layer (electron transit layer), and a source electrode, a drain electrode and a gate electrode formed over the n-GaN layer (compound semiconductor layer) are provided. A recess portion is formed inside an area between the source electrode and the drain electrode of the n-GaN layer (compound semiconductor layer) and at a portion separating from the gate electrode.

Claims

9 · 2 independent · depth 2
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9 granted claims

Classifications

6 codes
IPC · International Patent Classification
Section H — Electricity
  • H01L21/335
  • H01L29/778
USPC · US Patent Classification
257/194257/E29.246438/172257/E21.403

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File wrapper

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Pendency
2.4 y
865 days filing → grant
Office actions
1
after a restriction
Responses
1
1 RCE
Examiner
Victor A Mandala
art unit 2826 · TC 2800
Citations: 15 back · 3 forward

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Term & fees

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20100163928 A11 Jul 2010

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Citations

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