Compound semiconductor device and manufacturing method of the same
Granted 27 Mar 2012 · 2 office actions
Assignee: Fujitsu Limited
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Attorney: Attorney · Log in to unlock
Inventors: Atsushi Yamada, Tadahiro Imada · Examiner: Victor A Mandala · AU 2826 · TC 2800
Life of the patent
10 dated eventsAbstract
An i-GaN layer (electron transit layer), an n-GaN layer (compound semiconductor layer) formed over the i-GaN layer (electron transit layer), and a source electrode, a drain electrode and a gate electrode formed over the n-GaN layer (compound semiconductor layer) are provided. A recess portion is formed inside an area between the source electrode and the drain electrode of the n-GaN layer (compound semiconductor layer) and at a portion separating from the gate electrode.
Claims
9 · 2 independent · depth 2Classifications
6 codes- H01L21/335
- H01L29/778
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1 priority documents›Priority documents — 1
| Type | Document | Date |
|---|---|---|
| related publication | US 20100163928 A1 | 1 Jul 2010 |
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